Hybrid heat exchanger

• US 8,453,467 B2
• Filed: 10/13/2006
• Issued: 06/04/2013
• Est. Priority Date: 10/13/2006
• Status: Active Grant

• Current Assignee: Dell Products LP (Dell Technologies Inc.)
• Original Assignee: Dell Products LP (Dell Technologies Inc.)
• Inventors: Hood, Charles D. III, Sauciuc, Ioan, Tantoush, Mohammed
• Primary Examiner(s): Jules, Frantz
• Assistant Examiner(s): Bauer, Cassey D
• Application Number:
  US11/580,671
• Publication Number:
  US 20080087024A1
• Time in Patent Office: 2,426 Days
• Field of Search: 62/32, 623/32, 622/592, 62/37
• US Class Current: 62/3.2
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 2321/0251 by a gas
• CPC Class Codes: F28D 1/0408 Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids F28F9/0234 takes precedence
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction
• CPC Class Codes: H10N 15/00 Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect integrated devices or assemblies of multiple devices H10N19/00

Abstract

A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.

Claims

1. A heat exchanger assembly comprising:

a passive heat exchanger;

an active heat exchanger; and

a fan adapted to draw air through the passive heat exchanger and to blow air through the active heat exchanger.

2. The assembly of claim 1, wherein the passive heat exchanger comprises a radiator.

3. The assembly of claim 1, wherein the active heat exchanger comprises a cold plate having a first side and a second side.

4. The assembly of claim 3, wherein the active heat exchanger further comprises a first thermoelectric cooler in thermal communication with the first side of the cold plate, and a second thermoelectric cooler in thermal communication with the second side of the cold plate.

5. The assembly of claim 4, further comprising a first heat sink in thermal communication with the first thermoelectric cooler.

6. The assembly of claim 5, further comprising a second heat sink in thermal communication with the second thermoelectric cooler.

7. The assembly of claim 3, wherein coolant circulates through the cold plate.

8. The assembly of claim 3, further comprising a pump for circulating coolant through the cold plate.

9. A heat exchanger assembly comprising:

a passive heat exchanger;

an active heat exchanger;

a fan adapted to draw air through the passive heat exchanger and to blow air through the active heat exchanger; and

a pump for circulating coolant through the active heat exchanger.

10. The assembly of claim 9, wherein the passive heat exchanger comprises a radiator.

11. The assembly of claim 9, wherein the active heat exchanger comprises a cold plate having a first side and a second side.

12. The assembly of claim 11, wherein the active heat exchanger further comprises a first thermoelectric cooler in thermal communication with the first side of the cold plate, and a second thermoelectric cooler in thermal communication with the second side of the cold plate.

13. The assembly of claim 12, further comprising a first heat sink in thermal communication with the first thermoelectric cooler.

14. The assembly of claim 13, further comprising a second heat sink in thermal communication with the second thermoelectric cooler.