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Multi-station sequential curing of dielectric films

  • US 8,454,750 B1
  • Filed: 03/20/2007
  • Issued: 06/04/2013
  • Est. Priority Date: 04/26/2005
  • Status: Active Grant
First Claim
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1. A chamber for processing semiconductor wafers, comprising:

  • a plurality of processing stations, each processing station having a wafer support, a radiation source, and a window disposed between the wafer support and the radiation source; and

    a mechanism to transfer a wafer to each processing station, wherein the stations are configured to;

    expose a wafer supported by the wafer support to radiation from the radiation source, andprovide wafer exposure characteristics that vary radiation wavelength for at least two of the plurality of stations.

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