Microneedle structure and production method therefor
First Claim
1. A method for forming a microneedle structure from a wafer, the microneedle structure including a microneedle contiguous with, and projecting from, a substrate, the microneedle having a set of contiguous upright surfaces standing substantially perpendicular to the substrate, and an inclined surface inclined so as to intersect with the set of contiguous upright surfaces, the method comprising the steps of:
- (a) processing the wafer by a first etching process to define the set of contiguous upright surfaces;
(b) coating the upright surfaces with a protective coating; and
(c) performing a wet etching process on the substrate to render the upright surfaces as exterior surfaces of the microneedle, and form the inclined surface as an exterior surface of the microneedle intersecting with the upright surfaces.
0 Assignments
0 Petitions
Accused Products
Abstract
A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
29 Citations
22 Claims
-
1. A method for forming a microneedle structure from a wafer, the microneedle structure including a microneedle contiguous with, and projecting from, a substrate, the microneedle having a set of contiguous upright surfaces standing substantially perpendicular to the substrate, and an inclined surface inclined so as to intersect with the set of contiguous upright surfaces, the method comprising the steps of:
-
(a) processing the wafer by a first etching process to define the set of contiguous upright surfaces; (b) coating the upright surfaces with a protective coating; and (c) performing a wet etching process on the substrate to render the upright surfaces as exterior surfaces of the microneedle, and form the inclined surface as an exterior surface of the microneedle intersecting with the upright surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A method for forming a microneedle structure from a wafer, the microneedle structure including a microneedle contiguous with, and projecting from, a substrate, the microneedle having a set of contiguous upright surfaces standing substantially perpendicular to the substrate, and an inclined surface inclined so as to intersect with the set of contiguous upright surfaces, the method comprising the steps of:
-
(a) processing the wafer by a dry etching process to cut slots into the wafer so as to define the set of contiguous upright surfaces; (b) coating the upright surfaces with a protective coating; (c) performing an anisotropic wet etch on the substrate to render the upright surfaces as exterior surfaces of the microneedle, and form the inclined surface as an exterior surface of the microneedle intersecting with the upright surfaces, while lowering the surrounding surface of the wafer to define the substrate; and (d) removing the protective coating. - View Dependent Claims (20, 21, 22)
-
Specification