Memory devices and formation methods
First Claim
1. A memory device comprising:
- an integrated circuit havingan electrical insulator material thereover;
a memory cell having a word line, an access diode above the word line, a state-changeable memory element above the access diode and containing chalcogenide phase change material, and a bit line above the memory element all electrically connected in series, the access diode containing a p-n junction in a semiconductor material, the bit line and the word line overlapping at a cross-point, and the access diode and memory element extending between the word line and the bit line at the cross-point; and
an electrically insulative adhesion material over the insulator material and bonding the word line to the insulator material.
1 Assignment
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Accused Products
Abstract
A method includes forming an electrical insulator material over an integrated circuit having a metal-containing conductive interconnect and activating a dopant in a semiconductor material of a substrate to provide a doped region. The doped region provides a junction of opposite conductivity types. After activating the dopant, the substrate is bonded to the insulator material and at least some of the substrate is removed where bonded to the insulator material. After the removing, a memory cell is formed having a word line, an access diode, a state-changeable memory element containing chalcogenide phase change material, and a bit line all electrically connected in series, the access diode containing the junction as a p-n junction. A memory device includes an adhesion material over the insulator material and bonding the word line to the insulator material.
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Citations
25 Claims
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1. A memory device comprising:
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an integrated circuit having an electrical insulator material thereover; a memory cell having a word line, an access diode above the word line, a state-changeable memory element above the access diode and containing chalcogenide phase change material, and a bit line above the memory element all electrically connected in series, the access diode containing a p-n junction in a semiconductor material, the bit line and the word line overlapping at a cross-point, and the access diode and memory element extending between the word line and the bit line at the cross-point; and an electrically insulative adhesion material over the insulator material and bonding the word line to the insulator material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A memory device comprising:
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an integrated circuit having an electrical insulator material thereover; a memory cell having a word line, an access diode above the word line, a state-changeable memory element above the access diode and containing chalcogenide phase change material, and a bit line above the memory element all electrically connected in series, the access diode containing a p-n junction in a semiconductor material, the bit line and the word line overlapping at a cross-point, and the access diode and memory element extending between the word line and the bit line at the cross-point; and an electrically conductive adhesion material over the insulator material and bonding the word line to the insulator material. - View Dependent Claims (12, 13, 14)
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15. A memory device comprising:
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an integrated circuit having an electrical insulator material thereover; and a memory cell having a word line, an access diode above the word line, a state-changeable memory element above the access diode and containing chalcogenide phase change material, and a bit line above the memory element all electrically connected in series, the access diode containing a p-n junction in a semiconductor material, the bit line and the word line overlapping at a cross-point, the access diode and memory element extending between the word line and the bit line at the cross-point, a via in series electrical connection with and between the access diode and the memory element, the via comprising a conductive liner and insulative fill material radially inward thereof; and an adhesion material over the insulator material and bonding the word line to the insulator material. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification