Light emitting diode module, and light emitting diode lamp

• US 8,455,888 B2
• Filed: 12/27/2010
• Issued: 06/04/2013
• Est. Priority Date: 05/20/2010
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Lin, Ming-Te, Lin, Ming-Yao, Liu, Chih-Hsuan, Tai, Kuang-Yu, Ying, Shang-Pin
• Primary Examiner(s): Mandala, Victor A
• Assistant Examiner(s): MOORE, WHITNEY
• Application Number:
  US12/978,646
• Publication Number:
  US 20110284878A1
• Time in Patent Office: 890 Days
• Field of Search: 257/72, 257/88, 257/98, 257/E33.073, 257/E33.056
• US Class Current: 257/88
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 29/67 characterised by the arrangement of fans
• CPC Class Codes: F21V 29/677 the fans being used for discharging
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21Y 2107/40 on the sides of polyhedrons, e.g. cubes or pyramids
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A light emitting diode (LED) lamp including a socket, an LED module disposed on the socket, and a lamp housing assembled to the socket is provided. LED module includes a supporting member and a plurality of LED packages, wherein each LED package includes a chip carrier, a reflective member, an LED chip, a lens, and a phosphor layer. Reflective member mounted on the chip carrier has a recess for exposing parts of the chip carrier. LED chip disposed in the recess. Lens encapsulating the LED chip has a light-emitting surface, a first reflection surface bonded with the reflective member and a second reflection surface, wherein the LED chip faces the light-emitting surface of the lens.

Claims

1. A light emitting diode (LED) module, comprising:

a supporting member;

a plurality of LED packages, assembled with the supporting member, each of the LED packages comprising;

a chip carrier, mounted on the supporting member;

a reflective member, mounted on the chip carrier and having a recess for exposing parts of the chip carrier;

an LED chip, disposed in the recess;

a lens, encapsulating the LED chip, the lens having a light-emitting surface, a first total reflection surface connected with the reflective member and a second total reflection surface, the LED chip facing the light-emitting surface of the lens, wherein the lens fills the recess of the reflective member; and

a phosphor layer, disposed on the light-emitting surface of the lens.

2. The LED module of claim 1, further comprising a heat sink integrated in the supporting member.

3. The LED module of claim 2, further comprising a fan assembled to the heat sink.

4. The LED module of claim 1, wherein the lenses of the LED packages are constituted in a pillar, an intersection of each light-emitting surface and an orthogonal plane of an extending axis of the pillar is an arc, and the arc is 1/n of a circle, where n is the quantity of the lenses.

5. The LED module of claim 4, wherein an intersection of the plurality of light-emitting surfaces and the orthogonal plane of the extending axis is a circle.

6. The LED module of claim 4, wherein the lens has an indentation, a depth of the indentation decreases along the extending axis from the light-emitting surface toward the LED chip.

7. The LED module of claim 4, wherein the LED packages comprising:

a first group of the LED packages; and

a second group of the LED packages, wherein the LED chips of the each groups are in two different levels along the extending axis.

8. The LED module of claim 4, wherein the lens has a pair of adhesion surfaces located at opposite sides of the first and the second total reflection surfaces, the adhesion surfaces of different lens are connected to one other.

9. The LED module of claim 1, wherein the LED chip of each of the LED packages is encircled by the first total reflection surface and the second total reflection surface.

10. The LED module of claim 1, wherein a light propagating toward the first total reflection surface is reflected back to the light-emitting surface of the lens, and a light propagating toward the second total reflection surface is reflected back to the light-emitting surface of the lens.

11. The LED module of claim 1, wherein the lenses of the LED packages are connected to one other such that the light-emitting surfaces of the lenses are connected to one other.

12. The LED module of claim 1, wherein the second total reflection surface is not connected with the reflective member.

13. The LED module of claim 1, wherein the first total reflection surface is in contact with the reflective member.

14. A light emitting diode (LED) lamp, comprising:

a socket;

an LED module, disposed on the socket, comprising;

a supporting member;

a plurality of LED packages, assembled with the supporting member, each of the LED packages comprising;

a chip carrier, mounted on the supporting member;

a reflective member, mounted on the chip carrier and having a recess for exposing parts of the chip carrier;

an LED chip, disposed in the recess;

a lens, encapsulating the LED chip, the lens having a light-emitting surface, a first total reflection surface connected with the reflective member and a second total reflection surface, the LED chip facing the light-emitting surface of the lens;

a phosphor layer, disposed on the light-emitting surface of the lens; and

a lamp housing, encapsulating the LED module, wherein the lenses of the LED packages are connected to one other such that the light-emitting surfaces of the lenses are connected to one other.

15. The LED lamp of claim 14, further comprising a filtration member, disposed on the inner wall of the lamp housing.

16. The LED lamp of claim 14, wherein the lenses of the LED packages are constituted in a pillar, an intersection of each light-emitting surface and an orthogonal plane of an extending axis of the pillar is an arc, and the arc is 1/n of a circle, where n is the quantity of the lens.

17. The LED lamp of claim 16, wherein an intersection of the plurality of light-emitting surfaces and the orthogonal plane of the extending axis is a circle.

18. The LED lamp of claim 16, wherein the lens has an indentation, a depth of the indentation decreases along the extending axis from the light-emitting surface toward the LED chip.

19. The LED lamp of claim 16, wherein the LED packages comprising:

a plurality groups of the LED packages, wherein the LED chips of the each groups are in different levels along the extending axis.

20. The LED lamp of claim 14, wherein the lens has a pair of adhesion surfaces located at opposite sides of the first and the second total reflection surfaces, the adhesion surfaces of different lens are connected to one other.

21. The LED lamp of claim 14, wherein the LED chip is mounted on a supporting surface of the chip carrier, and the first total reflection surface extends from the supporting surface of the chip carrier toward the light-emitting surface.

22. The LED lamp of claim 14, wherein the LED chip is encircled by the first total reflection surface and the second total reflection surface.

23. The LED lamp of claim 14, wherein a light propagating toward the first total reflection surface is reflected back to the light-emitting surface of the lens, and a light propagating toward the second total reflection surface is reflected back to the light-emitting surface of the lens.

24. The LED lamp of claim 14, wherein the lenses of the LED packages are connected to one other such that the light-emitting surfaces of the lenses are connected to one other.

25. The LED module of claim 14, wherein the first total reflection surface is in contact with the reflective member.