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Package-integrated thin film LED

  • US 8,455,913 B2
  • Filed: 12/16/2010
  • Issued: 06/04/2013
  • Est. Priority Date: 10/28/2004
  • Status: Active Grant
First Claim
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1. A method comprising:

  • providing light emitting diode (LED) layers grown on a growth substrate, the LED layers comprising a first epitaxial layer of a first conductivity type, a second epitaxial layer of a second conductivity type, and an active layer disposed between the first and second epitaxial layers, wherein a primary emission surface on a first side of the first epitaxial layer is substantially parallel to the active layer, the LED layers forming at least one individual LED;

    providing at least one package substrate comprising a support surface having one or more electrical contact pads thereon for electrical connection to the first and second epitaxial layers and a region surrounding the electrical contact pads that is unaffected by the bonding process;

    placing the LED layers attached to the growth substrate on the package substrate such that the second epitaxial layer is facing a contact pad on the package substrate;

    bonding the second epitaxial layer to the first contact pad using localized pressure; and

    removing the growth substrate.

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