Lead frame assembly, package structure and LED package structure
First Claim
1. A package structure adapted for mounting at least one light emitting diode (LED) die, said package structure comprising:
- an insulating housing having a top surface that is formed with a cavity; and
a lead frame unit including;
a first lead frame portion covered by said insulating housing, and having a die-bonding area exposed within said cavity and adapted for mounting said LED die, anda second lead frame portion covered by said insulating housing, and having a conductive surface exposed through a portion of said top surface of said insulating housing offset from a bottom surface of said cavity and adapted for electrical connection with an end of a conductive wire.
2 Assignments
0 Petitions
Accused Products
Abstract
A package structure is adapted for mounting at least one light emitting diode (LED) die. The package structure includes an insulating housing having a top surface that is formed with a cavity, and a lead frame unit. The lead frame unit includes a first lead frame portion and a second lead frame portion. The first lead frame portion is covered by the insulating housing, and has a die-bonding area exposed within the cavity and adapted for mounting the LED die. The second lead frame portion is covered by the insulating housing, and has a conductive surface exposed outwardly of the top surface of the insulating housing and adapted for electrical connection with an end of a conductive wire.
16 Citations
15 Claims
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1. A package structure adapted for mounting at least one light emitting diode (LED) die, said package structure comprising:
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an insulating housing having a top surface that is formed with a cavity; and a lead frame unit including; a first lead frame portion covered by said insulating housing, and having a die-bonding area exposed within said cavity and adapted for mounting said LED die, and a second lead frame portion covered by said insulating housing, and having a conductive surface exposed through a portion of said top surface of said insulating housing offset from a bottom surface of said cavity and adapted for electrical connection with an end of a conductive wire. - View Dependent Claims (2, 3)
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4. A package structure, adapted for mounting at least one light emitting diode (LED) die, said package structure comprising:
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an insulating housing having a top surface that is formed with a cavity; and a lead frame unit including; a first lead frame portion covered by said insulating housing, and having a die-bonding area exposed within said cavity and adapted for mounting said LED die, and a second lead frame portion covered by said insulating housing, and having a conductive surface exposed outwardly through said top surface of said insulating housing and adapted for electrical connection with an end of a conductive wire; wherein said conductive surface of said second lead frame portion and said top surface of said insulating housing are located in a plane. - View Dependent Claims (5)
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6. A light emitting diode (LED) package structure comprising:
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an insulating housing having a top surface that is formed with a cavity; an LED die; a lead frame unit including; a first lead frame portion covered by said insulating housing and having a die-bonding area exposed within said cavity said LED die, and a second lead frame portion covered by said insulating housing, and having a conductive surface exposed through a portion of said top surface of said insulating housing offset from a bottom surface of said cavity and disposed higher than said LED die; at least one conductive wire having one end connected fixedly to said conductive surface of said second lead frame portion, and the other end extending into said cavity of said insulating housing and connected fixedly to said LED die; and an encapsulating material filled in said cavity of said insulating housing for covering said LED die. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification