Adhesion type area sensor and display device having adhesion type area sensor
First Claim
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1. A semiconductor device comprising:
- a pixel comprising a light receiving portion and a display portion, the pixel comprising a first thin film transistor, a photodiode, a reset gate signal line, a sensor gate signal line, a sensor output wiring, and a sensor electric power source line,wherein the first thin film transistor comprises a semiconductor layer,wherein the photodiode comprises a photoelectric conversion layer,wherein the semiconductor layer and the photoelectric conversion layer are formed on a same surface,wherein when a light from the display portion is reflected by a subject, the pixel is configured to irradiate the photoelectric conversion layer with the light reflected by the subject,wherein a first terminal of the first thin film transistor is electrically connected to the sensor output wiring,wherein a second terminal of the first thin film transistor is electrically connected to the sensor electric power source line,wherein a gate of the first thin film transistor is electrically connected to a first terminal of the photodiode,wherein a gate insulating film is interposed between the semiconductor layer and the gate of the first thin film transistor,wherein an inter layer film is formed over the gate of the first thin film transistor, andwherein the inter layer film is in contact with the gate insulating film over the photoelectric conversion layer.
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Abstract
A lightweight, thin, small size semiconductor device is provided. A pixel has a display portion, and a light receiving portion comprising a photodiode. A transistor is used with the semiconductor device for controlling the operation of the display portion and the light receiving portion.
68 Citations
30 Claims
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1. A semiconductor device comprising:
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a pixel comprising a light receiving portion and a display portion, the pixel comprising a first thin film transistor, a photodiode, a reset gate signal line, a sensor gate signal line, a sensor output wiring, and a sensor electric power source line, wherein the first thin film transistor comprises a semiconductor layer, wherein the photodiode comprises a photoelectric conversion layer, wherein the semiconductor layer and the photoelectric conversion layer are formed on a same surface, wherein when a light from the display portion is reflected by a subject, the pixel is configured to irradiate the photoelectric conversion layer with the light reflected by the subject, wherein a first terminal of the first thin film transistor is electrically connected to the sensor output wiring, wherein a second terminal of the first thin film transistor is electrically connected to the sensor electric power source line, wherein a gate of the first thin film transistor is electrically connected to a first terminal of the photodiode, wherein a gate insulating film is interposed between the semiconductor layer and the gate of the first thin film transistor, wherein an inter layer film is formed over the gate of the first thin film transistor, and wherein the inter layer film is in contact with the gate insulating film over the photoelectric conversion layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor device comprising:
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a driver portion comprising a first thin film transistor; and a sensor portion configured to display an image by using a light emitted from a light source, the sensor portion comprising a pixel comprising a second thin film transistor, a photodiode, a reset gate signal line, a sensor gate signal line, a sensor output wiring, and a sensor electric power source line, wherein the first thin film transistor comprises a first semiconductor layer formed on a base film over a glass substrate, wherein the second thin film transistor comprises a second semiconductor layer formed on the base film over the glass substrate, wherein the photodiode comprises a third semiconductor layer formed on the base film over the glass substrate, wherein when the light emitted from the light source is reflected by a subject, the sensor portion is configured to irradiate the third semiconductor layer with the light reflected by the subject, wherein a first terminal of the second thin film transistor is electrically connected to the sensor output wiring, wherein a second terminal of the second thin film transistor is electrically connected to the sensor electric power source line, wherein a gate of the second thin film transistor is electrically connected to a first terminal of the photodiode, wherein a gate insulating film is interposed between the second semiconductor layer and the gate of the second thin film transistor, wherein an inter layer film is formed over the gate of the second thin film transistor, and wherein the inter layer film is in contact with the gate insulating film over the third semiconductor layer. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A semiconductor device comprising:
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a pixel comprising a light receiving portion and a display portion, the pixel comprising a first thin film transistor, a photodiode, a reset gate signal line, a sensor gate signal line, a sensor output wiring, and a sensor electric power source line, wherein the first thin film transistor comprises a semiconductor layer, wherein the photodiode comprises a photoelectric conversion layer, wherein the semiconductor layer and the photoelectric conversion layer are formed on a same surface, wherein the pixel is configured to receive a reflected light from a subject in order to scan an image of the subject, wherein a first terminal of the first thin film transistor is electrically connected to the sensor output wiring, wherein a second terminal of the first thin film transistor is electrically connected to the sensor electric power source line, wherein a gate of the first thin film transistor is electrically connected to a first terminal of the photodiode, wherein a gate insulating film is interposed between the semiconductor layer and the gate of the first thin film transistor, wherein an inter layer film is formed over the gate of the first thin film transistor, and wherein the inter layer film is in contact with the gate insulating film over the photoelectric conversion layer. - View Dependent Claims (18, 19, 20, 21, 22, 23)
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24. A semiconductor device comprising:
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a driver portion comprising a first thin film transistor; and a sensor portion configured to display an image by using a light emitted from a light source, the sensor portion comprising a pixel comprising a second thin film transistor, a photodiode, a reset gate signal line, a sensor gate signal line, a sensor output wiring, and a sensor electric power source line, wherein the first thin film transistor comprises a first semiconductor layer formed on a base film over a glass substrate, wherein the second thin film transistor comprises a second semiconductor layer formed on the base film over the glass substrate, wherein the photodiode comprises a third semiconductor layer formed on the base film over the glass substrate, wherein the sensor portion is configured to receive a reflected light from a subject in order to scan an image of the subject, wherein a first terminal of the second thin film transistor is electrically connected to the sensor output wiring, wherein a second terminal of the second thin film transistor is electrically connected to the sensor electric power source line, wherein a gate of the second thin film transistor is electrically connected to a first terminal of the photodiode, wherein a gate insulating film is interposed between the second semiconductor layer and the gate of the second thin film transistor, wherein an inter layer film is formed over the gate of the second thin film transistor, and wherein the inter layer film is in contact with the gate insulating film over the third semiconductor layer. - View Dependent Claims (25, 26, 27, 28, 29, 30)
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Specification