Electromagnetic interference shields with piezos

• US 8,457,333 B2
• Filed: 02/21/2012
• Issued: 06/04/2013
• Est. Priority Date: 09/05/2008
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Yeates, Kyle, Lynch, Stephen Brian, Dabov, Teodor
• Primary Examiner(s): Garber, Charles
• Assistant Examiner(s): MUSTAPHA, ABDULFATTAH B
• Application Number:
  US13/401,729
• Publication Number:
  US 20120148081A1
• Time in Patent Office: 469 Days
• Field of Search: 381/174, 381/190, 381/345, 381/386, 381/388
• US Class Current: 381/190
• CPC Class Codes: H04R 17/00 Piezoelectric transducers; Electrostrictive transducers piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners H10N30/00
• CPC Class Codes: H04R 17/10 Resonant transducers, i.e. adapted to produce maximum output at a predetermined frequency
• CPC Class Codes: H04R 2499/11 Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate

Abstract

Methods and apparatus for improving the acoustical performance associated with a speaker, such as a piezoelectric speaker, are disclosed. According to one aspect, an apparatus includes a substrate, a can mounted on the substrate, and a piezoelectric speaker arrangement. The piezoelectric speaker arrangement is at least partially mounted on the can. In one embodiment, the substrate is a printed circuit board (PCB) and the can is an electromagnetic interference (EMI) shielding can.

Claims

1. An electronic device comprising:

an electronic device housing;

a printed circuit board (PCB);

a component, the component being mounted on the PCB and substantially enclosing a first volume of air;

an audio exit opening arranged through a surface of the electronic device housing;

an audio seal enclosing a second volume of air within the electronic device housing, the second volume of air in direct contact with the component and the audio exit opening; and

a speaker mounted on a surface of the component so that the first volume of air enclosed by the component serves as a back volume and the second volume of air serves as a front volume, the two volumes of air operative to enhance sound waves produced by the speaker.

2. An electronic device of claim 1, wherein the audio exit opening is also an opening for an electrical connector.

3. The electronic device of claim 1, wherein the speaker includes at least a diaphragm element arranged to vibrate when producing sound.

4. The electronic device of claim 1, wherein the surface of the component includes at least one opening, and wherein the speaker is at least partially mounted on the surface of the component over the at least one opening.

5. An electronic device comprising:

a printed circuit board (PCB);

at least one electrical component, the at least one electrical component being mounted on the PCB;

an electromagnetic interference (EMI) shield, the EMI shield being mounted directly to the PCB over and around the at least one electrical component and a first volume of air;

a second volume of air sealed within a portion of the electronic device, the second volume of air contained proximate to the EMI shield;

an audio exit opening configured to port audio out of the electronic device; and

a speaker mounted on an exterior surface of the EMI shield so that the first volume of air enclosed by the EMI shield serves as a back volume and the second volume of air serves as a front volume, the first and second volumes of air operative to enhance sound waves produced by the speaker.

6. The electronic device of claim 5, wherein the audio exit opening is also an opening for an electrical connector.

7. The electronic device of claim 5, wherein the speaker includes at least a diaphragm element arranged to vibrate when producing sound.

8. The electronic device of claim 5, wherein the first volume of air within the EMI shield is substantially sealed such that the first volume of air is confined within the EMI shield.

9. The electronic device of claim 5, further comprising:

an electronic device housing; and

at least one seal configured to confine the second volume of air within the portion of the electronic device,

wherein the second volume of air is arranged within the electronic device housing and in direct contact with the audio exit opening.

10. The electronic device of claim 5, wherein the EMI shield is arranged to amplify sound associated with the speaker.

11. The electronic device of claim 5, wherein the speaker comprises a piezoelectric speaker.

12. The electronic device of claim 5, wherein the EMI shield includes a recess area at a portion of the surface, and wherein the speaker is mounted on the surface of the EMI shield at the recess area.

13. The electronic device of claim 5, wherein the EMI shield includes a recess area at a portion of the surface, and wherein the speaker is mounted on the surface of the EMI shield in the recess area.

14. The electronic device of claim 5, wherein the EMI shield includes a recess area at a portion of the surface, and wherein the speaker is mounted on the surface of the EMI shield over the recess area.

15. The electronic device of claim 5, wherein the speaker includes at least a diaphragm element arranged to vibrate when producing sound, and wherein a support member holds the diaphragm element to the EMI shield.

16. The electronic device of claim 9, wherein a first end of the at least one seal is coupled to inner surface of the electronic device housing and a second end of the at least one seal is coupled directly to the speaker.

17. The electronic device of claim 9, wherein the EMI shield can includes a top surface, wherein the top surface includes at least one opening, and wherein the speaker arrangement is at least partially mounted on the top surface over the at least one opening.

18. The electronic device of claim 17, wherein a first end of the at least one seal is coupled to an inner surface of the electronic device housing and a second end of the at least one seal is coupled directly to the speaker.

19. The electronic device of claim 17, wherein the EMI shield includes a recess area at a portion of the top surface, and wherein the speaker is mounted on the surface of the EMI shield at the recess area.

20. The electronic device of claim 19, wherein a first end of the at least one seal is coupled to an inner surface of the electronic device housing and a second end of the at least one seal is coupled directly to the speaker.

21. An audio system disposed within an enclosure, the audio system comprising:

a printed circuit board (PCB);

an electromagnetic interference (EMI) shield coupled directly to the PCB and surrounding a first volume of air;

a speaker coupled to an exterior surface of the EMI shield;

a seal confining a second volume of air within a portion of the enclosure such that the second volume of air is in contact with the exterior surface of the EMI shield,

wherein the first and second volumes of air act respectively as back and front volumes of air for the speaker, the front and back volumes of air operative to enhance sound waves produced by the speaker.

22. The audio system as recited in claim 21, wherein an audio exit opening is disposed through a surface of the enclosure and configured to port audio out of the enclosure.

23. The audio system as recited in claim 22, wherein an opening in the EMI shield is in contact with a surface of the speaker that is in direct contact with the EMI shield.