Systems and methods for three dimensional sensors

• US 8,459,112 B2
• Filed: 06/09/2011
• Issued: 06/11/2013
• Est. Priority Date: 06/09/2011
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Rieger, Ryan W., Withanawasam, Lakshman, Jensen, Ronald J.
• Primary Examiner(s): Rodela, Eduardo A
• Application Number:
  US13/156,758
• Publication Number:
  US 20120313193A1
• Time in Patent Office: 733 Days
• Field of Search: 257/E23.01, 438/50, 438/51, 438/106, 731/708, 731/709, 734/93, 735/140.1, 735/141.6
• US Class Current: 73/514.16
• CPC Class Codes: G01R 33/0052 Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips devices based on galvano-magnetic effect or the like H10N50/85
• CPC Class Codes: G01R 33/0206 Three-component magnetometers
• CPC Class Codes: G01R 33/028 Electrodynamic magnetometers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

Systems and methods for fabricating a multi-axis sensor are provided. In one implementation, a method comprises: fabricating a first die having a first active surface with first application electronics; fabricating a second die having a second active surface with second application electronics and a plurality of electrical connections that extend from the second application electronics to a side surface interface of the second die that is adjacent to the second active surface; aligning the side surface interface to be coplanar with the first active surface; and forming at least one electrical connection between the plurality of electrical connections and the first active surface.

Claims

1. A directional sensor apparatus, the apparatus comprising:

a first die including a first active surface with first application electronics;

a second die bonded to a side surface of the first die, wherein the side surface is adjacent to the first active surface, the second die including;

a second active surface with second application electronics, wherein the second active surface is oriented perpendicular to the first active surface; and

a plurality of electrical connections extending from the second application electronics to a side surface interface of the second die that is adjacent to the second active surface, wherein the side surface interface of the second die is co-planar with the first active surface; and

at least one electrical interconnect between the plurality of electrical connections and the first active surface.

2. The apparatus of claim 1, wherein the first application electronics and the second application electronics each further comprise in-plane magnetic sensors.

3. The apparatus of claim 2, wherein the first application electronics comprises a two-axis magnetic sensor.

4. The apparatus of claim 2, wherein the second application electronics comprises a two-axis magnetic sensor.

5. The apparatus of claim 1, wherein the first die is bonded to the second die by bonding the second active surface of the second die to the first die.

6. The apparatus of claim 1, wherein the at least one electrical connection comprises a metallization layer deposited over the side surface interface and the first active surface.

7. The apparatus of claim 1, further comprising a third die bonded to the first die, the third die including:

a third active surface with third application electronics; and

at least one electrical interconnect between the third active surface and the first active surface.

8. An apparatus for sensing multiple axes, the apparatus comprising:

a first die having a first active surface;

a second die that includes

a second active surface, wherein the first active surface and the second active surface are contained within planes that are orthogonal to one another; and

a connection side surface interface including a plurality of electrical connections each coupled to the second active surface, wherein the connection side surface interface is adjacent to the second active surface;

a bonding material coupling the second die to a side surface of the first die, wherein the side surface is adjacent to the first active surface and the connection side surface is coplanar with the first active surface; and

at least one electrical interconnection formed between the plurality of electrical connections to the first active surface.

9. The apparatus of claim 8, wherein the first application electronics and the second application electronics each further comprise in-plane magnetic sensors;

and

wherein the first application electronics and the second application electronics together provide for sensing of magnetic fields on three orthogonal axes.

10. The apparatus of claim 8, wherein the at least one electrical interconnection is formed using wafer level processes.