Drug delivery chip and fabricating method thereof

• US 8,460,564 B2
• Filed: 01/28/2010
• Issued: 06/11/2013
• Est. Priority Date: 06/06/2009
• Status: Active Grant

• Current Assignee: National Taiwan University (Government of The Republic of China)
• Original Assignee: National Taiwan University (Government of The Republic of China)
• Inventors: Lu, Shey-Shi, Yang, Yao-Joe, Huang, Yu-Jie, Lin, Chii-Wann, Liao, Hsin-Hung, Wang, Tao, Huang, Pen-Li, Wang, Yao-Hong
• Primary Examiner(s): Ahmed, Shamim
• Application Number:
  US12/695,516
• Publication Number:
  US 20100312229A1
• Time in Patent Office: 1,230 Days
• Field of Search: 216/2, 216/13, 216/41, 216/58, 216/83, 216/17, 604/891.1
• US Class Current: 216/17
• CPC Class Codes: A61M 2205/3523 using telemetric means
• CPC Class Codes: A61M 2205/3569 sublocal, e.g. between console and disposable
• CPC Class Codes: A61M 5/14 Infusion devices, e.g. infusing by gravity; Blood infusion; Accessories therefor
• CPC Class Codes: A61M 5/14276 specially adapted for implantation
• CPC Class Codes: A61M 5/172 electrical or electronic A61M5/16804, A61M5/16831 take precedence

Abstract

A drug-delivery chip and a method of fabricating the same are provided. The drug-delivery chip has a main body having at least one drug receiving space individually formed with an opening for storing drugs therein; a thin film for sealing up the at least one drug receiving space; a first conductive wire connecting to one end of the thin film; a second conductive wire connecting to another end of the thin film; a signal-receiving module for receiving actuated signals; and a control module for applying voltages to first and second wire conductive s according to the actuated signal, thereby generating heat to break off the thin film for the release of a drug or drugs received in the at least one drug receiving space.

Claims

1. A method of fabricating a drug-delivery chip, comprising the steps of:

providing a substrate and there being a stack structure comprising an insulation layer, a conductive wire layer having void spaces, and a protection layer on a first surface of the substrate;

etching the protection layer at a position corresponding to the void spaces of the conductive wire layer to form an opening, wherein the opening is directly above the void spaces;

forming a metal thin film on the conductive wire layer to seal up the opening, wherein the metal thin film has two ends respectively connected to the conductive wire layer on each of two sides of the opening and is electrically connected to a control module via the conductive wire layer;

etching the substrate and the insulation layer to form a drug receiving space and expose the metal thin film;

filling the drug receiving space with a drug; and

installing a sealing film on a second surface of the substrate to seal up the drug filled in the drug receiving space.

2. The method of claim 1, before the step of the etching the substrate and the insulation layer, further comprising polishing the second surface of the substrate to reduce the thickness of the substrate.

3. The method of claim 1, before the step of the filling the drug receiving space with the drug, further comprising installing a plate layer on the second surface of the substrate at a side edge opposed to a position where the drug receiving space is formed, to enlarge the capacity of the drug receiving space.

4. The method of claim 1, wherein a resistance of the sealing film is greater than a resistance of the conductive wire layer.

5. A method of fabricating a drug-delivery chip, comprising the steps of:

providing a substrate and there being a stack structure comprising an insulation layer, a conductive wire layer having void spaces, and a protection layer on a first surface of the substrate;

etching the substrate and the insulation layer at a position corresponding to the void spaces of the conductive wire layer to form a drug receiving space, wherein the drug receiving space is directly over the void spaces;

filling the drug receiving space with a drug; and

installing a sealing film on a second surface of the substrate to seal up the drug filled in the drug receiving space.

6. The method of claim 5, before the step of the etching the substrate and the insulation layer, further comprising polishing the second surface of the substrate to reduce the thickness of the substrate.

7. The method of claim 5, before the step of the filling the drug receiving space with the drug, further comprising installing a plate layer on the second surface of the substrate at a side edge opposed to a position where the drug receiving space is formed, to enlarge the capacity of the drug receiving space.