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Self-aligned wafer bonding

  • US 8,460,794 B2
  • Filed: 07/10/2009
  • Issued: 06/11/2013
  • Est. Priority Date: 07/10/2009
  • Status: Active Grant
First Claim
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1. A wafer article comprising:

  • a substrate having a first major surface;

    two or more hydrophilic areas disposed on the first major surface of the substrate;

    hydrophobic areas surrounding the hydrophilic areas; and

    a eutectic bonding material disposed on the first major surface of the substrate and bonding a parallel and opposing major surface of a second substrate, the eutectic bonding material located between the first major surface of the substrate and the parallel and opposing major surface of the second substrate and the parallel and opposing major surface of a second substrate includes a hydrophilic area in registration with at least one of the two or more hydrophilic areas disposed on the substrate.

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