Method for encapsulating an electronic arrangement

• US 8,460,969 B2
• Filed: 11/18/2009
• Issued: 06/11/2013
• Est. Priority Date: 12/03/2008
• Status: Active Grant

• Current Assignee: Tesa SE (Maxingvest AG)
• Original Assignee: Tesa SE (Maxingvest AG)
• Inventors: Krawinkel, Thorsten, Keite-Telgenbscher, Klaus, Ellinger, Jan, Steen, Alexander
• Primary Examiner(s): Sarkar, Asok K
• Application Number:
  US12/996,716
• Publication Number:
  US 20110121356A1
• Time in Patent Office: 1,301 Days
• Field of Search: 257/108, 257/788, 428/343, 428/355.R, 438/106, 438/112, 523/522, 523/523, 524/505, 525/98, 525/99, 525/170, 525/171
• US Class Current: 438/112
• CPC Class Codes: C03C 27/10 with the aid of adhesive specially adapted for that purpose
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C09J 153/00 Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
• CPC Class Codes: C09J 153/005 Modified block copolymers
• CPC Class Codes: C09J 153/02 Vinyl aromatic monomers and conjugated dienes
• CPC Class Codes: C09J 153/025 modified
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: Y10T 428/28 Web or sheet containing structurally defined element or component and having an adhesive outermost layer
• CPC Class Codes: Y10T 428/2852 Adhesive compositions

Abstract

Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.

Claims

1. Method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on butylene block copolymers and comprising blocks formed from styrene is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated, said pressure-sensitive adhesive having a WVTR of less than 40 g/m²·

d, and/or has an OTR of less than 5000 g/m²·

d.bar.

2. Method according to claim 1, wherein the pressure-sensitive adhesive is provided in the form of an adhesive tape.

3. Method according to claim 1, wherein the pressure-sensitive adhesive and/or the regions of the electronic arrangement that are to be encapsulated are heated before, during and/or after the application of the pressure-sensitive adhesive.

4. Method according to claim 1, wherein the pressure-sensitive adhesive is crosslinked following application on the electronic arrangement.

5. Method according to claim 1, wherein the application of the pressure-sensitive adhesive takes place without subsequent curing.

6. Method according to claim 1, wherein the butylene block copolymers comprise polymer blocks formed by polymerization of isobutylene or isobutylene in combination with n-butene and/or 1,3-dienes.

7. Method according to claim 6, wherein the block copolymers have a polystyrene fraction of 10% to 35% by weight.

8. Method according to claim 6, wherein the pressure-sensitive adhesive has a block copolymer fraction of at least 20% by weight, and/or

the pressure-sensitive adhesive has a block copolymer fraction of not more than 90% by weight.

9. Method according to claim 6, wherein the fraction of the isobutylene block copolymers as a proportion of the total fraction of the block copolymers is at least 40% by weight.

10. Method according to claim 6, wherein the pressure-sensitive adhesive comprises hydrogenated resins having a degree of hydrogenation of at least 90%.

11. Method according to claim 6, wherein the pressure-sensitive adhesive comprises at least one resin which has a DACP value of more than 30°

C. and an MMAP value of more than 50°

C., and/or the pressure sensitive adhesive comprises at least one resin which has a softening temperature of more than 95°

C.

12. Method according to claim 6, wherein the pressure-sensitive adhesive comprises one or more additives selected from the group consisting of plasticizers, primary antioxidants, secondary antioxidants, in-process stabilizers, light stabilizers, processing assistants, endblock reinforcer resins, and elastomeric polymers.

13. Method according to claim 6, wherein the pressure-sensitive adhesive comprises one or more nanoscale fillers, transparent fillers and/or getter and/or scavenger fillers.

14. Method according to claim 6, wherein the pressure-sensitive adhesive has an average transmittance of at least 75%, in the wavelength range from 400 nm to 800 nm.

15. Method according to claim 6, wherein the pressure-sensitive adhesive is of UV-blocking design in the wavelength range from 320 nm to 400 nm, having an average transmittance of not more than 20%.

16. Method according to claim 6, wherein the pressure-sensitive adhesive is in the form of a carrier-free adhesive tape.

17. The method of claim 1, wherein said butylene block copolymers are isobutylene block copolymers.

18. Electronic arrangement having an organic electronic structure, and a pressure-sensitive adhesive, the electronic structure being at least partly encapsulated by the pressure-sensitive adhesive, wherein the pressure-sensitive adhesive comprises polymer blocks formed by polymerization of isobutylene or isobutylene in combination with n-butene and/or 1,3-dienes,and blocks formed from styrene, said pressure-sensitive adhesive having a WVTR of less than 40 g/m²·

d, and/or has an OTR of less than 5000 g/m²·

d·

bar.