Method for encapsulating an electronic arrangement
First Claim
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1. Method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on butylene block copolymers and comprising blocks formed from styrene is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated, said pressure-sensitive adhesive having a WVTR of less than 40 g/m2·
- d, and/or has an OTR of less than 5000 g/m2·
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Abstract
Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.
26 Citations
18 Claims
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1. Method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on butylene block copolymers and comprising blocks formed from styrene is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated, said pressure-sensitive adhesive having a WVTR of less than 40 g/m2·
- d, and/or has an OTR of less than 5000 g/m2·
d.bar. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
- d, and/or has an OTR of less than 5000 g/m2·
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18. Electronic arrangement having an organic electronic structure, and a pressure-sensitive adhesive, the electronic structure being at least partly encapsulated by the pressure-sensitive adhesive, wherein the pressure-sensitive adhesive comprises polymer blocks formed by polymerization of isobutylene or isobutylene in combination with n-butene and/or 1,3-dienes,and blocks formed from styrene, said pressure-sensitive adhesive having a WVTR of less than 40 g/m2·
- d, and/or has an OTR of less than 5000 g/m2·
d·
bar.
- d, and/or has an OTR of less than 5000 g/m2·
Specification