Light emitting diode package

• US 8,461,607 B2
• Filed: 12/28/2010
• Issued: 06/11/2013
• Est. Priority Date: 10/25/2010
• Status: Expired due to Fees

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: Tsang, Jian-Shihn
• Primary Examiner(s): NGUYEN, CUONG QUANG
• Application Number:
  US12/980,272
• Publication Number:
  US 20120098000A1
• Time in Patent Office: 896 Days
• Field of Search: 257 88-103, 257/E33.072, 257/E33.074
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

Abstract

An exemplary light emitting package includes a base, an LED chip mounted on the base, an encapsulant layer encapsulating the LED chip and a phosphor layer located above and separated from the LED chip. The phosphor layer includes a phosphor scattered portion and a clear portion without phosphor therein. An area of the phosphor scattered portion is smaller than the light emitting area of the encapsulant layer from which light emitted upwardly from the LED chip leaves the encapsulant layer.

Claims

1. A light emitting diode (LED) package comprising:

a base with electrical structures formed thereon;

an LED chip mounted on the base and electrically connected to the electrical structures;

an encapsulant layer encapsulating the LED chip; and

a phosphor layer located above and separated from the LED chip, the phosphor layer comprising a phosphor scattered portion and a clear portion without phosphor scattered therein, an area of the phosphor scattered portion being smaller than a light emitting area of the encapsulant layer from which light emitted from the LED chip leaves the encapsulant layer, the light emitted from the LED chip travelling upwardly to an outside of the LED package.

2. The LED package of claim 1 further comprising a reflection cup formed on the base, the encapsulant layer being received in the reflection cup, and the phosphor layer being positioned on the encapsulant layer and the reflection cup.

3. The LED package of claim 1, wherein the phosphor scattered portion of the phosphor layer contains at least two types of phosphors.

4. The LED package of claim 1, wherein the phosphor layer defines a plurality of micro grooves on a surface thereof.

5. The LED package of claim 1, wherein the phosphor layer comprises a first phosphor layer and a second phosphor layer, the first and second phosphor layers each comprises a phosphor scattered portion and a clear portion without phosphor scattered therein.

6. The LED package of claim 5, wherein the phosphor scattered portions of the first and second phosphor layers are staggered from each other.

7. The LED package of claim 5, wherein the phosphor scattered portion of the first second phosphor layer is over the phosphor scattered portion of the second phosphor layer.

8. The LED package of claim 5, wherein materials of phosphors contained in the first and second phosphor layers are different from each other.

9. The LED package of claim 1, wherein a light emitting layer of the LED chip is made of a material presented by Ga_1-x-yIn_xAl_yN, wherein 0≦

x≦

1, 0≦

y≦

1, 0≦

x+y≦

1.

10. An LED package comprising:

a base with electrical structures formed thereon;

a reflection cup formed on the base;

an LED chip positioned at a bottom of the reflection cup and electrically connected to the electrical structures;

an encapsulant layer received in the reflection cup and encapsulating the LED chip; and

a phosphor layer located above and separated from the LED chip and comprising a phosphor scattered portion and two clear portions located at two opposite sides of the phosphor scattered portion, wherein an area of the phosphor scattered portion is smaller than a light emitting area of the encapsulant layer from which light emitted from the LED chip leaves the encapsulant layer, the light emitted from the LED chip travelling upwardly to an outside of the LED package.

11. The LED package of claim 10, wherein the phosphor scattered portion contains at least two types of phosphors, and the clear portions contain no phosphor therein.

12. The LED package of claim 10, wherein a step is defined in a top inner side of the reflection cup, and the phosphor layer is positioned on the step.

13. The LED package of claim 12, wherein an additional step is defined in the reflection cup, an additional phosphor layer is positioned on the additional step and the encapsulant layer, the additional phosphor layer comprising a phosphor scattered portion and a clear portion.

14. The LED package of claim 13, wherein the phosphor scattered portions of the phosphor layer and the additional phosphor layer are staggered from each other.

15. The LED package of claim 13, wherein the phosphor scattered portion of the phosphor layer is over the phosphor scattered portion of the additional phosphor layer.