Per die temperature programming for thermally efficient integrated circuit (IC) operation
First Claim
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1. An apparatus comprising:
- a storage device to store one or more bits that cause a logic to operate at a frequency level corresponding to a junction temperature of the logic; and
a frequency controller to generate a clock signal corresponding to the frequency level, wherein the one or more bits correspond to one or more predefined power states.
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Abstract
Methods and apparatus to provide per die temperature programming for thermally efficient integrated circuit (IC) operation are described. In some embodiments, the junction temperature of an IC component is determined, e.g., to reduce power consumption and/or improve performance. Other embodiments are also described.
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Citations
20 Claims
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1. An apparatus comprising:
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a storage device to store one or more bits that cause a logic to operate at a frequency level corresponding to a junction temperature of the logic; and a frequency controller to generate a clock signal corresponding to the frequency level, wherein the one or more bits correspond to one or more predefined power states. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method comprising:
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determining a junction temperature of a logic; storing one or more data bits corresponding to one or more frequency levels in a storage device; generating a clock signal in accordance with at least-one of the frequency levels that causes the logic to operate at a temperature that is equal to or less than the junction temperature; and determining one of a value of power leakage generated, a value of dynamic capacitance of the logic, a thermal design power (TDP) of the logic during operation of the logic. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A system comprising:
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a display device to display one or more images; a non-volatile memory to store one or more bits corresponding to one or more frequency levels; a programmable frequency controller coupled to the display device and configured to generate a clock signal in accordance with at least one of the frequency levels to cause a logic to operate at a temperature that is equal to or less than a junction temperature of the logic; and a plurality of processor cores to generate data corresponding to the one or more images. - View Dependent Claims (19, 20)
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Specification