Method for temperature compensation in MEMS resonators with isolated regions of distinct material
First Claim
1. A method of forming a MEMS resonator device, comprising:
- forming a first structural material on a substrate;
forming a trench in the first structural material;
forming in the trench, a second structural material having a different Young'"'"'s modulus temperature coefficient than the first structural material;
patterning a resonator comprising both the first and second structural materials; and
anchoring the patterned resonator to an anchor;
where the second material is confined to a region of the resonator having a longest dimension that is shorter than a distance between the anchor and a point of the resonator furthest from the anchor.
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Accused Products
Abstract
MEMS resonators containing a first material and a second material to tailor the resonator'"'"'s temperature coefficient of frequency (TCF). The first material has a different Young'"'"'s modulus temperature coefficient than the second material. In one embodiment, the first material has a negative Young'"'"'s modulus temperature coefficient and the second material has a positive Young'"'"'s modulus temperature coefficient. In one such embodiment, the first material is a semiconductor and the second material is a dielectric. In a further embodiment, the quantity and location of the second material in the resonator is tailored to meet the resonator TCF specifications for a particular application. In an embodiment, the second material is isolated to a region of the resonator proximate to a point of maximum stress within the resonator. In a particular embodiment, the resonator includes a first material with a trench containing the second material.
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Citations
21 Claims
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1. A method of forming a MEMS resonator device, comprising:
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forming a first structural material on a substrate; forming a trench in the first structural material; forming in the trench, a second structural material having a different Young'"'"'s modulus temperature coefficient than the first structural material; patterning a resonator comprising both the first and second structural materials; and anchoring the patterned resonator to an anchor; where the second material is confined to a region of the resonator having a longest dimension that is shorter than a distance between the anchor and a point of the resonator furthest from the anchor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of forming a MEMS resonator, comprising:
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forming a first structural material on a substrate; forming a trench in the first structural material; forming in the trench, a second structural material having a different Young'"'"'s modulus temperature coefficient than the first structural material; and patterning a resonator comprising both the first and second structural materials; where the second material is isolated to a region of the resonator proximate to a point of maximum stress within the resonator during operation.
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21. A method of forming a MEMS resonator, comprising:
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forming a first structural material on a substrate; forming a trench in the first structural material; forming in the trench, a second structural material having a different Young'"'"'s modulus temperature coefficient than the first structural material; and patterning a resonator comprising both the first and second structural materials; where the resonator is a bulk-mode resonator, and where the method further comprises; forming a plurality of trenches in the first structural material, the plurality of trenches being arranged in a radial array; and forming the second structural material in the plurality of trenches.
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Specification