×

MEMS power inductor with magnetic laminations formed in a crack resistant high aspect ratio structure

  • US 8,466,537 B1
  • Filed: 12/30/2011
  • Issued: 06/18/2013
  • Est. Priority Date: 12/30/2011
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor inductor comprising:

  • a first structure being non-conductive and having a top surface;

    a second structure being non-conductive and having a top surface, a side wall surface, and a bottom surface, the bottom surface touching the top surface of the first structure;

    a third structure being non-conductive and having a top surface, a side wall surface, and a bottom surface, the bottom surface of the third structure touching the top surface of the first structure, the side wall surface of the third structure touching the side wall surface of the second structure, the second structure and the third structure having different material characteristics;

    a plurality of lower magnetic structures that touch the first and third structures, each lower magnetic structure having a top surface, and being spaced apart and electrically isolated from each other lower magnetic structure;

    a fourth structure being non-conductive and having a top surface, and a bottom surface, the bottom surface of the fourth structure touching the top surfaces of the second structure, the third structure, and each lower magnetic structure; and

    a conductive trace having a top surface, touching the fourth structure, and lying directly over and spaced apart from each of the lower magnetic structures.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×