Integration of piezoelectric materials with substrates

• US 8,466,606 B2
• Filed: 10/06/2010
• Issued: 06/18/2013
• Est. Priority Date: 03/31/2009
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Sand 9, Inc. (Analog Devices, Inc.)
• Inventors: Chen, David M., Kuypers, Jan H., Gaidarzhy, Alexei, Zolfagharkhani, Guiti, Goodelle, Jason
• Primary Examiner(s): DOUGHERTY, THOMAS M
• Application Number:
  US12/899,447
• Publication Number:
  US 20110187227A1
• Time in Patent Office: 986 Days
• Field of Search: 310/340, 310/344, 310/348, 310/349
• US Class Current: 310/348
• CPC Class Codes: H03H 3/007 for the manufacture of electromechanical resonators or networks
• CPC Class Codes: H03H 9/02007 of bulk acoustic wave devices
• CPC Class Codes: H03H 9/02244 of microelectro-mechanical resonators
• CPC Class Codes: H03H 9/02535 of surface acoustic wave devices
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Claims

1. A packaged micromechanical resonator, comprising:

a substrate;

a cap comprising integrated circuitry;

a first portion of an electrically conductive material between the substrate and the cap, disposed such that the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume;

a micromechanical resonator comprising a piezoelectric material disposed within the enclosed volume; and

a second portion of the electrically conductive material between the substrate and the cap constructed and arranged such that a signal can be transmitted between the micromechanical resonator and the integrated circuitry through the second portion of the electrically conductive material.

5. A resonator as in claim 1, wherein the resonator comprises a microelectromechanical systems (MEMS) resonator.

6. A resonator as in claim 1, wherein the resonator is configured to support Lamb waves.

7. A resonator as in claim 1, wherein the resonator comprises a piezoelectric material.

8. A resonator as in claim 1, wherein the resonator comprises a piezoelectric material chosen from the group consisting of:

aluminum nitride (AlN), zinc oxide (ZnO), cadmium sulfide (CdS), lead titanate (PbTiO₃), lead zirconate titanate (PZT), lithium niobate (LiNbO₃), lithium tantalate (LiTaO₃), potassium niobate (KNbO₃), Li₂B₄O₇, langasite (La₃Ga₅SiO₁₄), gallium arsenside (GaAs), barium sodium niobate, bismuth germanium oxide, indium arsenide, and indium antimonide.

9. A resonator as in claim 1, wherein the resonator is suspended above the substrate.

10. A resonator as in claim 1, wherein the substrate has a cavity formed therein, and wherein the resonator is suspended above the cavity.

11. A resonator as in claim 1, wherein the first and/or second portions of electrically conductive material comprise an electrically conductive polymer and/or a metal.

12. A resonator as in claim 1, wherein the first and/or second portions of electrically conductive material comprise gold, silver, copper, and/or tin.

13. A resonator as in claim 1, wherein the integrated circuitry is constructed and arranged to control the resonator.

14. A resonator as in claim 1, wherein the integrated circuitry is constructed and arranged to actuate the resonator and/or detect vibration of the resonator.

15. A resonator as in claim 1, wherein the first portion of the electrically conductive material circumscribes the resonator.

16. A resonator as in claim 1, wherein the first and/or second portions of the electrically conductive material have a resistivity of less than about 1000 Ω

m.

17. A resonator as in claim 1, wherein the packaged resonator comprises a hermetic seal.

19. A resonator as in claim 1, wherein the first and/or second portions of the electrically conductive material has a thermal conductivity of at least about 5 W/mK.

20. A resonator as in claim 1, wherein the second portion of the electrically conductive material is used as part of a ground electrical connection.

21. A resonator as in claim 1, wherein the first and/or second portions of the electrically conductive material are printed, sputtered, or evaporated onto the substrate and/or cap.

22. A resonator as in claim 1, wherein the substrate and/or cap comprises at least a portion of a semiconductor wafer.

23. A resonator as in claim 1, wherein the first and/or second portions of the electrically conductive material have an average thickness of between about 0.1 microns and about 100 microns.

24. A resonator as in claim 1, wherein the first and second portions of the electrically conductive material are the same portion of the electrically conductive material.

25. A resonator as in claim 1, wherein the first and second portions of the electrically conductive material are different portions of the electrically conductive material.

26. A resonator as in claim 1, wherein the first and second portions of the electrically conductive material have the same chemical composition.

27. A resonator as in claim 1, wherein the first and second portions of the electrically conductive material have different chemical compositions.

28. The resonator of claim 1, wherein the first portion of the electrically conductive material forms a seal between the substrate and the cap.

29. The resonator of claim 28, wherein the seal is a hermetic seal.

30. The resonator of claim 29, wherein the seal makes a vacuum seal.

31. The resonator of claim 29, wherein the seal makes a no-vacuum seal.

32. The resonator of claim 28, wherein the seal is a non-hermetic seal.

2. A packaged micromechanical resonator, comprising:

a substrate;

a cap comprising integrated circuitry;

a first portion of an electrically conductive material between the substrate and the cap, disposed such that the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume;

a micromechanical resonator disposed within the enclosed volume; and

a second portion of the electrically conductive material between the substrate and the cap constructed and arranged such that a signal can be transmitted between the micromechanical resonator and the integrated circuitry through the second portion of the electrically conductive material;

wherein the first and/or second portions of the electrically conductive material have an average thickness of at least about 5 microns.

3. A packaged micromechanical resonator, comprising:

a substrate;

a cap comprising integrated circuitry;

a first portion of an electrically conductive material between the substrate and the cap, disposed such that the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume;

a micromechanical resonator configured to oscillate in plane disposed within the enclosed volume; and

a second portion of the electrically conductive material between the substrate and the cap constructed and arranged such that a signal can be transmitted between the micromechanical resonator and the integrated circuitry through the second portion of the electrically conductive material.

4. A method of packaging a micromechanical resonator, comprising:

providing a substrate on which a micromechanical resonator is disposed;

providing a cap comprising integrated circuitry;

positioning first and second portions of an electrically conductive material between the substrate and the cap; and

modifying the first and second portions of the electrically conductive material such that the first portion of the electrically conductive material produces a seal between the substrate and the cap and such that a signal can be transmitted between the micromechanical resonator and the integrated circuitry through the second portion of the electrically conductive material.

18. A method as in claim 4, wherein modifying the first and/or second portions of the electrically conductive material comprises heating the first and/or second portions of the electrically conductive material.