3D chip stack skew reduction with resonant clock and inductive coupling

• US 8,466,739 B2
• Filed: 09/07/2012
• Issued: 06/18/2013
• Est. Priority Date: 08/25/2011
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Kim, Jae-Joon, Silberman, Joel A., Lin, Yu-Shiang, Pang, Liang-Teck
• Primary Examiner(s): LUU, AN T
• Application Number:
  US13/607,089
• Publication Number:
  US 20130049826A1
• Time in Patent Office: 284 Days
• Field of Search: 257/665, 257/676, 257/686, 257691-693, 257/E23.141, 257/E23.144, 257/E23.145, 327564-565
• US Class Current: 327/565
• CPC Class Codes: G06F 1/10 Distribution of clock signals , e.g. skew
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H03L 7/00 Automatic control of frequency or phase; Synchronisation

Abstract

There is provided a clock distribution network for synchronizing global clock signals within a 3D chip stack having two or more strata. The clock distribution network includes a plurality of clock distribution circuits, each being arranged on a respective one of the two or more strata for providing the global clock signals to various chip locations. Each of the plurality of clock distribution circuits includes a resonant circuit for providing stratum-to-stratum coupling for the clock distribution network. The resonant circuit includes at least one capacitor and at least one inductor.

Claims

1. A clock distribution network for synchronizing global clock signals within a 3D chip stack having two or more strata, the clock distribution network comprising:

a plurality of clock distribution circuits, each being arranged on a respective one of the two or more strata for providing the global clock signals to various chip locations;

wherein each of the plurality of clock distribution circuits comprises a resonant circuit for providing stratum-to-stratum coupling for the clock distribution network, the resonant circuit including at least one capacitor and at least one inductor.

2. The clock distribution network of claim 1, wherein inductor coils included within the resonant circuit on at least two of the two or more strata are aligned with respect to each other to form a coupling there between to reduce skewing of the global clock signals with respect to the various chip locations.

3. The clock distribution network of claim 2, wherein the two or more strata are configured with a front-to-back configuration or a back-to-back configuration, wherein the inductor coils that are aligned to form the coupling are located on respective front-sides of the two or more strata, and the coupling is enhanced by adding a back-side inductor having inductor coils aligned with the inductor coils on the front-sides.

4. The clock distribution network of claim 3, wherein the back-side inductor is formed by a re-distribution layer.

5. The clock distribution network of claim 1, wherein each of the plurality of clock distribution circuits comprises a respective one of a plurality of clock grids for providing the global clock signals to the various locations on the two or more strata.

6. The clock distribution network of claim 5, wherein each of the plurality of clock grids comprises at least one sector having the resonant circuit therein for providing stratum-to-stratum coupling for the clock distribution network.

7. The clock distribution network of claim 5, wherein each of the plurality of clock distribution circuits further comprises a respective one of a plurality of buffered clock trees, each of the plurality of buffered clock trees for driving a corresponding one of the plurality of clock grids on a same one of the two or more strata and having at least a root and a plurality of clock buffers.

8. The clock distribution network of claim 7, wherein each of the plurality of clock distribution circuits further comprises a respective one of a plurality of multiplexers, the plurality of multiplexers for providing a same single clock source to the root of each of the plurality of buffered clock trees.

9. The clock distribution network of claim 8, wherein the plurality of multiplexers comprise at least one tri-state multiplexer.

10. The clock distribution network of claim 8, wherein a particular one of the plurality of multiplexers from a particular one of the two or more strata selects the same single clock source, and provides the same single clock source to remaining ones of the plurality of multiplexers using chip-to-chip interconnects.

11. The clock distribution network of claim 6, wherein the plurality of clock buffers respectively included in each of the plurality of buffered clock trees comprise a sector clock buffer for driving the respective one of the plurality of clock grids and a plurality of clock relay buffers for relaying the global clock signals.

12. The clock distribution network of claim 11, wherein the at least one sector is connected to and driven by the sector clock buffer.

13. A clock distribution network for synchronizing global clock signals within a 3D chip stack having two or more strata, the clock distribution network comprising:

a plurality of clock grids, each being arranged on a respective one of the two or more strata for providing the global clock signals to various chip locations;

a plurality of buffered clock trees, each being arranged on the respective one of the two or more strata for driving a respective one of the plurality of clock grids on a same one of the two or more strata and having at least a root and a plurality of clock buffers;

a plurality of multiplexers, each being arranged on the respective one of the two or more strata, the plurality of multiplexers for providing a same single clock source to the root of each of the plurality of buffered clock trees,

wherein each of the plurality of clock grids comprises at least one sector having a resonant circuit therein for providing stratum-to-stratum coupling for the clock distribution network.

14. The clock distribution network of claim 13, wherein the plurality of clock buffers respectively included in each of the plurality of buffered clock trees comprise a sector clock buffer for driving the respective one of the plurality of clock grids and a plurality of clock relay buffers for relaying the global clock signals.

15. The clock distribution network of claim 14, wherein the at least one sector is connected to and driven by the sector clock buffer.

16. The clock distribution network of claim 13, wherein a particular one of the plurality of multiplexers from a particular one of the two or more strata selects the same single clock source, and provides the same single clock source to remaining ones of the plurality of multiplexers using chip-to-chip interconnects.

17. The clock distribution network of claim 13, wherein inductor coils comprised within the resonant circuit on at least two of the two or more strata are aligned with respect to each other to form a coupling there between to reduce skewing of the global clock signals with respect to the various locations.

18. The clock distribution network of claim 17, wherein the inductor coils within the at least one sector on a given one of the two or more strata are aligned with the inductor coils within the least one sector corresponding thereto on another given one of the two or more strata.

19. The clock distribution network of claim 17, wherein the two or more strata are configured with a front-to-back configuration or a back-to-back configuration, wherein the inductor coils that are aligned to form the coupling are located on respective front-sides of the two or more strata, and the coupling is enhanced by adding a back-side inductor having inductor coils aligned with the inductor coils on the front-sides.

20. The clock distribution network of claim 19, wherein the back-side inductor is formed by a re-distribution layer.