Planar inductor devices

• US 8,466,769 B2
• Filed: 04/14/2011
• Issued: 06/18/2013
• Est. Priority Date: 05/26/2010
• Status: Active Grant

• Current Assignee: TE Connectivity Solutions GmbH (TE Connectivity Limited)
• Original Assignee: Tyco Electronics Corporation (TE Connectivity Limited)
• Inventors: Dalmia, Sidharth, Nguyen, Khanh, Das, Jaydip, McGrath, Mark, Harrison, William Lee
• Primary Examiner(s): NGUYEN, TUYEN T
• Application Number:
  US13/087,112
• Publication Number:
  US 20110291789A1
• Time in Patent Office: 796 Days
• Field of Search: 336/65, 336/200, 336/225, 336/229, 336/232
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/045 with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
• CPC Class Codes: H01F 17/062 Toroidal core with turns of coil around it
• CPC Class Codes: H01F 2027/2814 with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
• CPC Class Codes: H01F 27/2804 Printed windings

Abstract

A multilayer inductor device includes a planar substrate, a ferrite body, and an outer and an inner conductive coil. The substrate includes plural dielectric layers with the ferrite body is disposed in the substrate. The outer and inner conductive coils are helically wrapped around the ferrite body. The outer conductive coil includes first upper conductors, first lower conductors, and first conductive vias vertically extending through the substrate and conductively coupled with the first upper and lower conductors. The inner conductive coil includes second upper conductors, second lower conductors, and second conductive vias vertically extending through the substrate and conductively coupled with the second upper and lower conductors. The inner conductive coil is disposed between the outer conductive coil and the ferrite body.

Claims

1. A multilayer inductor device comprising:

a planar substrate including a plurality of dielectric layers;

a ferrite body disposed in the substrate;

an outer conductive coil helically wrapped around the ferrite body, the outer conductive coil including a first plurality of upper conductors disposed on a first upper dielectric layer of the substrate, a first plurality of lower conductors disposed on a first lower dielectric layer of the substrate, and a first plurality of conductive vias vertically extending through the substrate and conductively coupled with the first plurality of upper conductors and the first plurality of lower conductors;

an inner conductive coil helically wrapped around the ferrite body, the inner conductive coil including a second plurality of upper conductors disposed on a second upper dielectric layer of the substrate, a second plurality of lower conductors disposed on a second lower dielectric layer of the substrate, and a second plurality of conductive vias vertically extending through the substrate and conductively coupled with the second plurality of upper conductors and the second plurality of lower conductors, wherein the inner conductive coil is disposed between the outer conductive coil and the ferrite body; and

a flexible dielectric layer disposed on the substrate, the flexible dielectric layer including a planar slab of a ferrite material that extends over the outer conductive coil and the inner conductive coil.

2. The device of claim 1, wherein the ferrite body includes an opening extending therethrough and each of the outer conductive coil and the inner conductive coil extends through the opening in the ferrite body.

3. The device of claim 1, wherein the second upper dielectric layer of the substrate is disposed between the ferrite body and the first upper dielectric layer of the substrate.

4. The device of claim 1, wherein the second lower dielectric layer of the substrate is disposed between the ferrite body and the first lower dielectric layer of the substrate.

5. The device of claim 1, wherein the ferrite body is entirely disposed in the substrate between the second upper dielectric layer of the substrate and the second lower dielectric layer of the substrate.

6. The device of claim 1, wherein the ferrite body has a shape of a toroid or an annulus with an opening extending through the ferrite body, further wherein the first plurality of conductive vias includes an inner set of vias disposed within the opening of the ferrite body and an outer set of vias disposed outside of the ferrite body.

7. The device of claim 1, wherein the ferrite body has a shape of a toroid or an annulus shape with an opening extending through the ferrite body, further wherein the second plurality of conductive vias includes an inner set of vias disposed within the opening of the ferrite body and an outer set of vias disposed outside of the ferrite body.

8. The device of claim 1, wherein at least one of the first plurality of upper conductors, the second plurality of upper conductors, the first plurality of lower conductors, or the second plurality of lower conductors includes one or more wire bonds.

9. The device of claim 1, wherein the substrate includes an interior cavity with the ferrite body disposed in the interior cavity, and the interior cavity is at least partially filled with a flexible dielectric material around the ferrite body.

10. The device of claim 9, wherein the flexible dielectric material in the interior cavity includes one or more high permeability materials.

11. The device of claim 9, further comprising a planar slab of a ferrite material disposed in the interior cavity of the substrate.

12. A multilayer inductor device comprising:

a substrate vertically extending between a lower surface and an opposite upper surface;

a ferrite body disposed in the substrate between the lower surface and the upper surface of the substrate;

an outer conductive coil helically wrapped around the ferrite body, the outer conductive coil including a first plurality of upper conductors disposed between the ferrite body and the upper surface of the substrate, a first plurality of lower conductors disposed between the ferrite body and the lower surface of the substrate, and a first plurality of conductive vias vertically extending through the substrate and conductively coupled with the first plurality of upper conductors and the first plurality of lower conductors;

an inner conductive coil helically wrapped around the ferrite body, the inner conductive coil including a second plurality of upper conductors disposed between the ferrite body and the first plurality of the upper conductors, a second plurality of lower conductors disposed between the ferrite body and the first plurality of the lower conductors, and a second plurality of conductive vias vertically extending through the substrate and conductively coupled with the second plurality of upper conductors and the second plurality of lower conductors, wherein the inner conductive coil is disposed between the outer conductive coil and the ferrite body; and

a flexible dielectric layer disposed on the substrate, the flexible dielectric layer including a planar slab of a ferrite material that extends over the outer conductive coil and the inner conductive coil.

13. The device of claim 12, wherein the ferrite body includes an opening extending therethrough and each of the outer conductive coil and the inner conductive coil extends through the opening in the ferrite body.

14. The device of claim 12, wherein the ferrite body has a shape of a toroid or an annulus with an opening extending through the ferrite body, further wherein the first plurality of conductive vias includes an inner set of vias disposed within the opening of the ferrite body and an outer set of vias disposed outside of the ferrite body.

15. The device of claim 12, wherein the ferrite body has a shape of a toroid or an annulus shape with an opening extending through the ferrite body, further wherein the second plurality of conductive vias includes an inner set of vias disposed within the opening of the ferrite body and an outer set of vias disposed outside of the ferrite body.

16. The device of claim 12, wherein at least one of the first plurality of upper conductors, the second plurality of upper conductors, the first plurality of lower conductors, or the second plurality of lower conductors includes one or more wire bonds.

17. The device of claim 12, wherein the substrate includes an interior cavity with the ferrite body disposed in the interior cavity, and the interior cavity is at least partially filled with a flexible dielectric material around the ferrite body.

18. The device of claim 17, wherein the flexible dielectric material in the interior cavity includes one or more high permeability materials.