Planar inductor devices
First Claim
1. A multilayer inductor device comprising:
- a planar substrate including a plurality of dielectric layers;
a ferrite body disposed in the substrate;
an outer conductive coil helically wrapped around the ferrite body, the outer conductive coil including a first plurality of upper conductors disposed on a first upper dielectric layer of the substrate, a first plurality of lower conductors disposed on a first lower dielectric layer of the substrate, and a first plurality of conductive vias vertically extending through the substrate and conductively coupled with the first plurality of upper conductors and the first plurality of lower conductors;
an inner conductive coil helically wrapped around the ferrite body, the inner conductive coil including a second plurality of upper conductors disposed on a second upper dielectric layer of the substrate, a second plurality of lower conductors disposed on a second lower dielectric layer of the substrate, and a second plurality of conductive vias vertically extending through the substrate and conductively coupled with the second plurality of upper conductors and the second plurality of lower conductors, wherein the inner conductive coil is disposed between the outer conductive coil and the ferrite body; and
a flexible dielectric layer disposed on the substrate, the flexible dielectric layer including a planar slab of a ferrite material that extends over the outer conductive coil and the inner conductive coil.
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Accused Products
Abstract
A multilayer inductor device includes a planar substrate, a ferrite body, and an outer and an inner conductive coil. The substrate includes plural dielectric layers with the ferrite body is disposed in the substrate. The outer and inner conductive coils are helically wrapped around the ferrite body. The outer conductive coil includes first upper conductors, first lower conductors, and first conductive vias vertically extending through the substrate and conductively coupled with the first upper and lower conductors. The inner conductive coil includes second upper conductors, second lower conductors, and second conductive vias vertically extending through the substrate and conductively coupled with the second upper and lower conductors. The inner conductive coil is disposed between the outer conductive coil and the ferrite body.
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Citations
18 Claims
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1. A multilayer inductor device comprising:
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a planar substrate including a plurality of dielectric layers; a ferrite body disposed in the substrate; an outer conductive coil helically wrapped around the ferrite body, the outer conductive coil including a first plurality of upper conductors disposed on a first upper dielectric layer of the substrate, a first plurality of lower conductors disposed on a first lower dielectric layer of the substrate, and a first plurality of conductive vias vertically extending through the substrate and conductively coupled with the first plurality of upper conductors and the first plurality of lower conductors; an inner conductive coil helically wrapped around the ferrite body, the inner conductive coil including a second plurality of upper conductors disposed on a second upper dielectric layer of the substrate, a second plurality of lower conductors disposed on a second lower dielectric layer of the substrate, and a second plurality of conductive vias vertically extending through the substrate and conductively coupled with the second plurality of upper conductors and the second plurality of lower conductors, wherein the inner conductive coil is disposed between the outer conductive coil and the ferrite body; and a flexible dielectric layer disposed on the substrate, the flexible dielectric layer including a planar slab of a ferrite material that extends over the outer conductive coil and the inner conductive coil. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A multilayer inductor device comprising:
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a substrate vertically extending between a lower surface and an opposite upper surface; a ferrite body disposed in the substrate between the lower surface and the upper surface of the substrate; an outer conductive coil helically wrapped around the ferrite body, the outer conductive coil including a first plurality of upper conductors disposed between the ferrite body and the upper surface of the substrate, a first plurality of lower conductors disposed between the ferrite body and the lower surface of the substrate, and a first plurality of conductive vias vertically extending through the substrate and conductively coupled with the first plurality of upper conductors and the first plurality of lower conductors; an inner conductive coil helically wrapped around the ferrite body, the inner conductive coil including a second plurality of upper conductors disposed between the ferrite body and the first plurality of the upper conductors, a second plurality of lower conductors disposed between the ferrite body and the first plurality of the lower conductors, and a second plurality of conductive vias vertically extending through the substrate and conductively coupled with the second plurality of upper conductors and the second plurality of lower conductors, wherein the inner conductive coil is disposed between the outer conductive coil and the ferrite body; and a flexible dielectric layer disposed on the substrate, the flexible dielectric layer including a planar slab of a ferrite material that extends over the outer conductive coil and the inner conductive coil. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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Specification