Integrated array transmit/receive module

• US 8,467,737 B2
• Filed: 12/31/2008
• Issued: 06/18/2013
• Est. Priority Date: 12/31/2008
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Choudhury, Debabani, Ruberto, Mark
• Primary Examiner(s): Donovan, Lincoln
• Assistant Examiner(s): CHENG, DIANA
• Application Number:
  US12/347,915
• Publication Number:
  US 20100167666A1
• Time in Patent Office: 1,630 Days
• Field of Search: 455/73, 342/368, 342/371, 342/372, 342/377
• US Class Current: 455/73
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01Q 1/523 between antennas of an array
• CPC Class Codes: H01Q 21/0025 Modular arrays
• CPC Class Codes: H01Q 21/062 using dipole aerials; H01Q21/067, H01Q21/068 take precedence
• CPC Class Codes: H01Q 21/065 Patch antenna array
• CPC Class Codes: H01Q 21/067 using endfire radiating aerial units transverse to the plane of the array

Abstract

Disclosed are integration approaches for mm-wave array type architectures using multilayer substrate technologies. For instance, an apparatus may include a first substrate layer, a second substrate layer, and a third substrate layer. The first substrate layer has a first plurality of array elements, and the second substrate layer has a second plurality of array elements. The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements. The first and second substrate layers are separated by approximately a half wavelength (λ/2) corresponding to the one or more RF signals.

Claims

1. An apparatus, comprising:

one or more first substrate layers having a first plurality of array elements;

one or more second substrate layers having a second plurality of array elements;

a third substrate layer;

an integrated circuit on the third substrate layer, the integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements; and

a connector module to exchange one or more further signals between the integrated circuit and a host module, the one or more further signals corresponding to the one or more RF signals;

wherein the first and second substrate layers are separated by approximately a half wavelength (λ

/2) corresponding to the one or more RF signals.

2. The apparatus of claim 1, wherein the one or more RF signals are each millimeter-wave signals.

3. The apparatus of claim 1, wherein the connector module is configured to receive a flexible cable having one or more conductors, the flexible cable to convey the one or more further signals.

4. The apparatus of claim 1, wherein the third substrate layer is between the first and second substrate layers.

5. The apparatus of claim 1, further comprising a printed circuit board to exchange one or more further signals with the integrated circuit, the one or more further signals corresponding to the one or more RF signals.

6. The apparatus of claim 1, wherein the first and second pluralities of array elements includes pairs of corresponding array elements, each pair including a first array element from the first plurality and a second array element from the second plurality.

7. The apparatus of claim 1, wherein each of the pairs of corresponding array elements are in alignment.

8. The apparatus of claim 1, further comprising one or more slots arranged between the pairs of corresponding array elements.

9. The apparatus of claim 8, wherein each of the one or more slots comprises an electromagnetic bandgap (EBG) structure.

10. The apparatus of claim. 8, wherein each of the one or more slots comprises an air gap.

11. An apparatus, comprising

a host module;

and

an array transmit and receive module;

wherein the array transmit and receive module includes;

one or more first substrate layers having a first plurality of array elements;

one or more second substrate layers having a second plurality of array elements;

a third substrate layer; and

an integrated circuit on the third substrate layer, the integrated circuit to exchange

one or more radio frequency (RF) signals with the first and second pluralities of array elements;

wherein the first and second substrate layers are separated by approximately half wavelength (λ

/2) corresponding to the one or more RF signals,

wherein the host module and the array transmit and receive module are to exchange one or more further signals, the one or more further signals corresponding to the one or more RF signals, and

wherein the array transmit and receive module further comprises a connector module to exchange the one or more further signals between the integrated circuit and the host module.

12. The apparatus of claim 11, further comprising:

a flexible cable coupled between the host module and the array transmit and receive module.

13. The apparatus of claim 11, further comprising a printed circuit board (PCB), wherein the PCB is coupled to the host module and the array transmit and receive module.

14. The apparatus of claim 13, wherein the PCB is to exchange the one or more further signals between the integrated circuit and the host module.

15. The apparatus of claim 11, wherein the one or more RE signals are each millimeter-wave signals.

16. The apparatus of claim 11, wherein the third substrate layer is between the one or more first substrate layers and the one or more second substrate layers.