Process for manufacturing EMI filters utilizing counter-bored capacitors to facilitate solder re-flow
First Claim
1. A process for manufacturing an electromagnetic interference (EMI) filter for use in an active implantable medical device (AIMD), comprising the steps of:
- a) providing a capacitor comprising a thickness extending alone a longitudinal axis between spaced apart first and second capacitor surfaces meeting a capacitor outer sidewall, wherein the capacitor is comprised of a dielectric material having interleaved, but spaced apart active and ground electrode plates therein, and at least one through hole having a first diameter perpendicular to the longitudinal axis thereof;
b) forming a well comprising a well sidewall having a continuous semi-circular shape in cross-section along an imaginary plane aligned with the longitudinal axis of the through hole, the well sidewall extending from a second diameter at the one of the first and second capacitor surfaces part-way into the thickness of the capacitor to the through hole, wherein the second diameter is greater than the first diameter of the through hole;
c) inserting a pin or a lead wire at least partially into the well and the through hole;
d) placing an electrically conductive material in the well, wherein the electrically conductive material comprises a liquid or semi-liquid material during at least a portion of the manufacturing process; and
e) utilizing the electrically conductive material to conductively couple the pin or the lead wire to one of the active or ground electrode plates.
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Accused Products
Abstract
An EMI filtered terminal assembly including at least one conductive terminal pin, a feedthrough capacitor, and a counter-bore associated with a passageway through the capacitor is described. Preferably, the feedthrough capacitor having counter-drilled or counter-bored holes on its top side is first bonded to a hermetic insulator. The counter-drilled or counter-bore holes in the capacitor provide greater volume for the electro-mechanical attachment between the capacitor and the terminal pin or lead wire, permitting robotic dispensing of, for example, thermal-setting conductive adhesive.
65 Citations
30 Claims
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1. A process for manufacturing an electromagnetic interference (EMI) filter for use in an active implantable medical device (AIMD), comprising the steps of:
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a) providing a capacitor comprising a thickness extending alone a longitudinal axis between spaced apart first and second capacitor surfaces meeting a capacitor outer sidewall, wherein the capacitor is comprised of a dielectric material having interleaved, but spaced apart active and ground electrode plates therein, and at least one through hole having a first diameter perpendicular to the longitudinal axis thereof; b) forming a well comprising a well sidewall having a continuous semi-circular shape in cross-section along an imaginary plane aligned with the longitudinal axis of the through hole, the well sidewall extending from a second diameter at the one of the first and second capacitor surfaces part-way into the thickness of the capacitor to the through hole, wherein the second diameter is greater than the first diameter of the through hole; c) inserting a pin or a lead wire at least partially into the well and the through hole; d) placing an electrically conductive material in the well, wherein the electrically conductive material comprises a liquid or semi-liquid material during at least a portion of the manufacturing process; and e) utilizing the electrically conductive material to conductively couple the pin or the lead wire to one of the active or ground electrode plates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A process for manufacturing an electromagnetic interference (EMI) filter for use in an active implantable medical device (AIMD), comprising the steps of:
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a) providing a capacitor comprising a thickness extending along a longitudinal axis between spaced apart first and second capacitor surfaces meeting a capacitor outer sidewall, wherein the capacitor is comprised of a dielectric material having interleaved, but spaced apart active and ground electrode plates therein, and at least one through hole having a first diameter perpendicular to the longitudinal axis thereof; b) forming a well comprising a well sidewall having a continuous semi-circular shape in cross-section along an imaginary plane aligned with the longitudinal axis of the through hole in the capacitor to thereby provide a second diameter greater than the first diameter of the through hole extending from one of the first and second capacitor surfaces part way into the thickness of the capacitor where the well meets the through hole; c) inserting a pin or a lead wire at least partially into the well and the through hole; d) placing an electrically conductive material in the well, wherein the electrically conductive material comprises a liquid or semi-liquid material during at least a portion of the manufacturing process; and e) utilizing the electrically conductive material to directly conductively couple the pin or the lead wire to one of the active or ground electrode plates without an intervening conductive termination surface for the electrode plates. - View Dependent Claims (25, 26, 27)
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28. A process for manufacturing an electromagnetic interference (EMI) filter for use in an active implantable medical device (AIMD), comprising the steps of:
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a) providing a capacitor comprised of a dielectric material having active and ground electrode plates therein, and at least one through hole; b) forming a well in a surface of the capacitor at one end of the through hole; c) inserting a pin or a lead wire at least partially into the through hole; d) placing a bonding washer against a mounting surface of the capacitor, wherein the bonding washer has an aperture configured to receive the pin or lead wire therethrough; e) placing an electrically conductive material in the well, wherein the electrically conductive material comprises a liquid or semi-liquid material during at least a portion of the manufacturing process; f) utilizing the electrically conductive material to conductively couple the pin or the lead wire to one of the active or ground electrode plates; and g) wherein the aperture of the bonding washer forms a path for gas to escape from the through hole as the electrically conductive material flows therein. - View Dependent Claims (29)
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30. A process for manufacturing an electromagnetic interference (EMI) filter for use in an active implantable medical device (AIMD), comprising the steps of:
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a) providing a capacitor comprising a thickness extending along a longitudinal axis between spaced apart first and second capacitor surfaces meeting a capacitor outer sidewall, wherein the capacitor is comprised of a dielectric material having interleaved, but spaced apart active and ground electrode plates therein, and at least one through hole having a first diameter perpendicular to the longitudinal axis thereof; b) forming a well comprising a well sidewall having an elliptical shape in cross-section along an imaginary plane aligned with the longitudinal axis of the through hole, the well sidewall extending from a second diameter at the one of the first and second capacitor surfaces part-way into the thickness of the capacitor to the through hole, wherein the elliptical cross-section of the well sidewall along the longitudinal axis is continuous from the second diameter being greater than the first diameter; c) inserting a pin or a lead wire at least partially into the well and the through hole; d) placing an electrically conductive material in the well, wherein the electrically conductive material comprises a liquid or semi-liquid material during at least a portion of the manufacturing process; and e) utilizing the electrically conductive material to conductively couple the pin or the lead wire to one of the active or ground electrode plates.
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Specification