Method of manufacturing silicon carbide semiconductor device

• US 8,470,672 B2
• Filed: 08/30/2011
• Issued: 06/25/2013
• Est. Priority Date: 08/31/2010
• Status: Active Grant

• Current Assignee: DENSO Corporation, Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: DENSO Corporation, Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Endo, Takeshi, Miyahara, Shinichiro, Konishi, Masaki, Fujiwara, Hirokazu, Morimoto, Jun, Ishikawa, Tsuyoshi, Katsuno, Takashi, Watanabe, Yukihiko, Morino, Tomoo
• Primary Examiner(s): Geyer, Scott B
• Application Number:
  US13/220,756
• Publication Number:
  US 20120052642A1
• Time in Patent Office: 665 Days
• Field of Search: None
• US Class Current: 438/270
• CPC Class Codes: H01L 21/30604 Chemical etching
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 29/1608 Silicon carbide
• CPC Class Codes: H01L 29/4236 within a trench, e.g. trench gate electrode, groove gate electrode
• CPC Class Codes: H01L 29/66068 the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236

Abstract

A method of manufacturing a semiconductor device includes forming a drift layer on a substrate; forming a base layer on the drift layer; forming a trench to penetrate the base layer and to reach the drift layer; rounding off a part of a shoulder corner and a part of a bottom corner of the trench; covering an inner wall of the trench with an organic film; implanting an impurity to a surface portion of the base layer; forming a source region by activating the implanted impurity; and removing the organic film after the source region is formed, in which the substrate, the drift layer, the base layer and the source region are made of silicon carbide, and the implanting and the activating of the impurity are performed under a condition that the trench is covered with the organic film.

Claims

1. A method of manufacturing a silicon carbide semiconductor device comprising:

forming a drift layer on a substrate having a first conductive type or a second conductive type;

forming a base layer on the drift layer or in a surface portion of the drift layer;

forming a trench to penetrate the base layer and to reach the drift layer;

rounding off a part of a shoulder corner and a part of a bottom corner of the trench;

covering an inner wall of the trench with an organic film;

implanting an impurity having the first conductive type to a surface portion of the base layer;

forming a source region by activating the implanted impurity in the surface portion of the base layer;

removing the organic film after the forming of the source region;

forming a gate insulation film on the inner wall of the trench;

forming a gate electrode on the gate insulation film in the trench;

forming a source electrode to be electrically coupled with the source region and the base layer; and

forming a drain electrode on a back side of the substrate,

wherein the substrate is made of silicon carbide,

wherein the drift layer is made of silicon carbide having the first conductive type, and is doped at a lower impurity concentration than an impurity concentration of the substrate,

wherein the base layer is made of silicon carbide having the second conductive type,

wherein the shoulder corner of the trench is disposed at an open side of the trench,

wherein the implanting of the impurity is performed under a condition that the trench is covered with the organic film,

wherein the activating of the implanted impurity is performed under the condition that the trench is covered with the organic film, and

wherein the source region is made of silicon carbide having the first conductive type, and is doped at a higher impurity concentration than an impurity concentration of the drift layer.

2. The method according to claim 1,

wherein the rounding off is performed by a hydrogen etching method, a sacrificial oxidation method or a dry etching method.

3. The method according to claim 1,

wherein the source electrode is formed on an interlayer insulation film, which is formed on the gate electrode.

4. The method according to claim 1,

wherein the organic film is made of a resist.

5. The method according to claim 4,

wherein the resist has a viscosity of 20 cp or less.

6. The method according to claim 4, further comprising:

performing a heat treatment to carbonize the resist before the implanting of the impurity.

7. The method according to claim 1,

wherein the removing of the organic film is performed by a wet oxidation method, a dry oxidation method or a O₂ ashing method.

8. The method according to claim 7,

wherein an oxidation temperature is set to 1000°

C. or lower in a case where a surface of the substrate is a Si-face, and

wherein an oxidation temperature is set to 900°

C. or lower in a case where the surface of the substrate is a C-face.