Printable, flexible and stretchable diamond for thermal management

• US 8,470,701 B2
• Filed: 04/03/2009
• Issued: 06/25/2013
• Est. Priority Date: 04/03/2008
• Status: Expired due to Fees

• Current Assignee: Board of Trustees of The University of Illinois, X Display Company Technology Limited (Sensinnovat BVBA), John Crane Incorporated (Smiths Group International Holdings Ltd.)
• Original Assignee: Advanced Diamond Technologies, Inc., Board of Trustees of The University of Illinois
• Inventors: Rogers, John A., Kim, Dae Hyeong, Meitl, Matthew, Menard, Etienne, Carlisle, John, Kim, Tae Ho, Choi, Won Mook
• Primary Examiner(s): Dang, Trung Q
• Application Number:
  US12/418,071
• Publication Number:
  US 20100052112A1
• Time in Patent Office: 1,544 Days
• Field of Search: 438/584, 257/E21.09
• US Class Current: 438/584
• CPC Class Codes: B81B 7/0093 by cooling
• CPC Class Codes: B81C 1/0038 Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
• CPC Class Codes: B81C 2201/0191 Transfer of a layer from a carrier wafer to a device wafer
• CPC Class Codes: H01L 21/02381 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02488 Insulating materials
• CPC Class Codes: H01L 21/02527 Carbon, e.g. diamond-like carbon
• CPC Class Codes: H01L 21/02595 polycrystalline
• CPC Class Codes: H01L 21/0262 Reduction or decomposition of gaseous compounds, e.g. CVD
• CPC Class Codes: H01L 21/02664 Aftertreatments planarisation in general H01L21/304
• CPC Class Codes: H01L 21/20 Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
• CPC Class Codes: H01L 23/3732 Diamonds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

Claims

1. A method of making printable diamond patterns, the method comprising:

providing a flexible receiving substrate;

growing a diamond layer on a supporting substrate; and

patterning the diamond layer to form a plurality of diamond microstructures capable of printing to the flexible receiving substrate.

2. The method of claim 1, wherein the diamond layer has a thickness that is less than or equal to 2 μ

m.

3. The method of claim 1, further comprising a bridge connected to an end of the diamond microstructure to provide registered transfer of the diamond microstructure from the supporting substrate to the receiving substrate.

4. The method of claim 1, further comprising printing the plurality of diamond microstructures to said receiving substrate.

5. The method of claim 4, wherein the flexible receiving substrate is part of a device or a device component.

6. The method of claim 5, wherein the diamond provides a performance characteristic to the device or device component, the performance characteristic selected from the group consisting of:

a. thermal dissipation;

b. hardness;

c. high modulus;

d. index of refraction;

e. bendability;

f. chemical inertness;

g. biocompatibility; and

h. wear resistance.