Stackable variable height via package and method

• US 8,471,154 B1
• Filed: 08/06/2009
• Issued: 06/25/2013
• Est. Priority Date: 08/06/2009
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Yoshida, Akito, Dreiza, Mahmoud
• Primary Examiner(s): PATEL, ISHWARBHAI B
• Application Number:
  US12/537,048
• Time in Patent Office: 1,419 Days
• Field of Search: None
• US Class Current: 174/260
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06568 the devices decreasing in size, e.g. pyramidical stack
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/1076 Shape of the containers
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H05K 3/42 : Plated through-holes or plated via connections
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

A stackable variable height via package includes a substrate having a first surface and terminals thereon. The terminals include a first terminal and a second terminal. Vias are on the terminals, the vias including a first via on the first terminal and a second via on the second terminal. The first via has a height from the first surface of the substrate less than a height of the second via from the first surface of the substrate. The package further includes a package body and via apertures in the package body to expose the vias. Forming the stackable variable height via package with variable height vias readily accommodate stacking of additional packages having different types of terminals, e.g., LGA and BGA type packages, as well as variable degrees of warpage on the stackable variable height via package. Further, the vias are formed with a minimum pitch.

Claims

1. A stackable variable height via package comprising:

a substrate comprising a first surface;

terminals on the first surface of the substrate, the terminals comprising a first terminal and a second terminal;

conductive vias on the terminals, the conductive vias comprising reflowed solder, the conductive vias comprising a first conductive via on the first terminal and a second conductive via on the second terminal, the first conductive via having a height from the first surface of the substrate less than a height of the second conductive via from the first surface of the substrate;

a package body enclosing the conductive vias; and

apertures formed in the package body to expose the conductive vias, the conductive vias extending through the package body between the terminals and the apertures.

2. The stackable variable height via package of claim 1 further comprising:

an electronic component mounted to the first surface of the substrate.

3. The stackable variable height via package of claim 2 further comprising:

an adhesive mounting an inactive surface of the electronic component to the first surface of the substrate;

first traces on the first surface of the substrate, the first traces being electrically connected to the terminals; and

bond wires electrically connecting the first traces to bond pads on an active surface of the electronic component.

4. The stackable variable height via package of claim 3 wherein the package body further encloses the electronic component and the bond wires.

5. The stackable variable height via package of claim 3 further comprising:

second traces on a second surface of the substrate; and

substrate vias electrically connecting the first traces with the second traces.

6. The stackable variable height via package of claim 5 further comprising interconnection balls connected to the second traces, the interconnection balls for mounting the stackable variable height via package to a larger substrate.

7. The stackable variable height via package of claim 1 further comprising a solder mask on the first surface of the substrate, the solder mask having terminal openings formed therein, wherein exposed portions of the terminals are exposed through the terminal openings, the exposed portions defining Solder Mask Defined (SMD) lands.

8. The stackable variable height via package of claim 7 wherein the SMD lands comprise a first SMD land and a second SMD land, the first SMD land comprising an exposed portion of the first terminal exposed through a first terminal opening of the terminal openings, the second SMD land comprising an exposed portion of the second terminal exposed through a second terminal opening of the terminal openings, wherein a surface area of the first SMD land is equal to a surface area of the second SMD land.

9. The stackable variable height via package of claim 7 wherein the SMD lands comprise a first SMD land and a second SMD land, the first SMD land comprising an exposed portion of the first terminal exposed through a first terminal opening of the terminal openings, the second SMD land comprising an exposed portion of the second terminal exposed through a second terminal opening of the terminal openings, wherein a surface area of the first SMD land is greater than a surface area of the second SMD land.

10. The stackable variable height via package of claim 7 wherein the exposed portions further define Non Solder Mask Defined (NSMD) lands.

11. The stackable variable height via package of claim 10 wherein the NSMD lands comprise a first NSMD land and the SMD lands comprise a first SMD land, the first NSMD land comprising the first terminal entirely exposed through a first terminal opening of the terminal openings, and the first SMD land comprising an exposed portion of the second terminal exposed through a second terminal opening of the terminal openings, wherein a surface area of the first NSMD land is greater than a surface area of the first SMD land.

12. The stackable variable height via package of claim 10 wherein the NSMD lands comprise a first NSMD land and the SMD lands comprise a first SMD land, the first NSMD land comprising the first terminal including a first surface and sides of the first terminal entirely exposed through a first terminal opening of the terminal openings, and the first SMD land comprising an exposed portion of the second terminal exposed through a second terminal opening of the terminal openings, wherein a surface area of the first surface of the first NSMD land is equal to a surface area of the first SMD land.

13. The stackable variable height via package of claim 1 wherein the first terminal defines a first Non Solder Mask Defined (NSMD) land and the second terminal defines a second NSMD land, wherein a surface area of the first NSMD land is equal to a surface area of the second NSMD land.

14. The stackable variable height via package of claim 1 wherein the first terminal defines a first Non Solder Mask Defined (NSMD) land and the second terminal defines a second NSMD land, wherein a surface area of the first NSMD land is greater than a surface area of the second NSMD land.

15. A stackable variable height via package comprising:

a substrate comprising a first surface;

a first terminal coupled to the first surface of the substrate;

a first conductive via coupled to the first terminal;

a second conductive via coupled to the second terminal, the first and second conductive vias comprising reflowed solder, the first conductive via having a height from the first surface of the substrate less than a height of the second conductive via from the first surface of the substrate;

a package body enclosing the first and second conductive vias; and

apertures formed in the package body to expose the first and second conductive vias, the first and second conductive vias extending through the package body between the first and second terminals and the apertures.

16. The stackable variable height via package of claim 15 further comprising:

a solder mask coupled to the first surface of the substrate;

a first Solder Mask Defined (SMD) land comprising an exposed portion of the first terminal exposed through a first terminal opening in the solder mask; and

a second SMD land comprising an exposed portion of the second terminal exposed through a second terminal opening in the solder mask.

17. The stackable variable height via package of claim 16 wherein a surface area of the first SMD land is equal to a surface area of the second SMD land.

18. A stackable variable height via package comprising:

a substrate comprising a first surface;

a first terminal coupled to the first surface of the substrate;

a second terminal coupled to the first surface of the substrate;

a first conductive via coupled to the first terminal formed by reflowing a first spherical solder ball;

a second conductive via coupled to the second terminal formed by reflowing a second spherical solder ball, the first solder ball having a smaller volume than the second solder ball;

a package body enclosing the first and second conductive vias; and

apertures formed in the package body to expose the first and second conductive vias, the first and second conductive vias extending through the package body between the first and second terminals and the apertures;

wherein the first conductive via has a height from the first surface of the substrate less than a height of the second conductive via from the first surface of the substrate.