Light emitting diode package and method of manufacturing the same

• US 8,471,271 B2
• Filed: 06/11/2010
• Issued: 06/25/2013
• Est. Priority Date: 02/23/2006
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Son, Won-Jin
• Primary Examiner(s): YEUNG LOPEZ, FEIFEI
• Application Number:
  US12/814,336
• Publication Number:
  US 20100258823A1
• Time in Patent Office: 1,110 Days
• Field of Search: None
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.

Claims

1. A light emitting diode package, comprising:

a package body with a cavity at an upper portion,

wherein the package body includes a bottom surface, and

wherein the bottom surface includes a first substantially flat portion, a second substantially flat portion, and a third recessed portion disposed between the first substantially flat portion and the second substantially flat portion;

a plurality of light emitting diode (LED) chips in the cavity;

a phosphor on the plurality of LED chips;

a mold member covering the plurality of LED chips and the phosphor;

a plurality of wires connected to the plurality of LED; and

a plurality of lead frames in the package body,

wherein at least one of the plurality of lead frames is straightly extended from the cavity of the package body to the third recessed portion of the bottom surface of the package body,

wherein one of the plurality of LED chips is disposed on the at least one of the plurality of lead frames, and

wherein the at least one of the plurality of lead frames is not electrically connected to the plurality of the LED chips.

2. The light emitting diode package according to claim 1, wherein the LED chips are LED chips of three colors (red, green, and blue) or blue LED chips.

3. The light emitting diode package according to claim 1, wherein the mold member is formed of silicon or epoxy resin and has one of a flat shape, a concave lens shape, or a convex lens shape.

4. The light emitting diode package according to claim 1, wherein a number of the plurality of lead frames is smaller than a number of electrodes of the LED chips.

5. The light emitting diode package according to claim 1, wherein the plurality of lead frames are disposed in a line such that they are spaced from each other in the cavity of the package body.

6. The light emitting diode package according to claim 1, wherein the package body is formed of at least one material selected from the group consisting of PC (polycarbonate), PCABS (polycarbonate acrylonitrile butadiene styrene), PPA (polyphthalamide), nylon, PET (polyethylene terephtalate), or PBT (polybutylene terephtalate).

7. The light emitting diode package according to claim 1, wherein each side surface of the cavity is formed so as to lean outward at a 105-120 degree angle.

8. A light emitting diode package, comprising:

a package body having an upper portion including a cavity, and a lower portion having a recessed surface being stepped down from the lowermost surface of the package body;

a plurality of LED chips in the cavity of the package body;

a plurality of lead frames in the package body, wherein at least one of the lead frames passes through the package body such that the at least one of the lead frames is extended from the cavity of the package body to the recessed surface of the lower portion of the package body;

a plurality of wires electrically connecting the plurality of LED chips with the plurality of the lead frames;

a phosphor on the plurality of the LED chips; and

a mold member covering the plurality of LED chips and the phosphor,

wherein the at least one of the lead frames is not electrically connected to the plurality of the LED chips.

9. The light emitting diode package according to claim 8, wherein the mold member is formed of silicon or epoxy resin and has one of a flat shape, a concave lens shape, and a convex lens shape.

10. The light emitting diode package according to claim 8, wherein at least two of the plurality of LED chips are a horizontal LED chip with first and second electrodes disposed in a horizontal structure.

11. The light emitting diode package according to claim 8, wherein the plurality of the LED chips are spaced from each other by a predetermined distance and disposed in a line in the cavity.

12. The light emitting diode package according to claim 8, wherein the plurality of LED chips are LED chips of three colors (red, green, and blue) or blue LED chips.