Process-variation tolerant series-connected NMOS and PMOS diodes, and standard cells, tags, and sensors containing the same

• US 8,471,308 B2
• Filed: 03/14/2011
• Issued: 06/25/2013
• Est. Priority Date: 12/07/2005
• Status: Active Grant

• Current Assignee: Ensurge Micropower ASA
• Original Assignee: Kovio Incorporated (Ensurge Micropower ASA)
• Inventors: Subramanian, Vivek, Smith, Patrick
• Primary Examiner(s): Pham, Thanh V
• Application Number:
  US13/047,627
• Publication Number:
  US 20110234289A1
• Time in Patent Office: 834 Days
• Field of Search: 257/212, 257/288, 307/5, 307/141.8, 323/220
• US Class Current: 257/288
• CPC Class Codes: H01L 27/1285 using control of the annealing or irradiation parameters, e.g. using different scanning direction or intensity for different transistors
• CPC Class Codes: H01L 27/1288 employing particular masking sequences or specially adapted masks, e.g. half-tone mask
• CPC Class Codes: H01L 27/1292 using liquid deposition, e.g. printing
• CPC Class Codes: H01L 29/86 controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
• CPC Class Codes: Y10S 257/91 Diode arrays, e.g. diode read-only memory array

Abstract

Process variation-tolerant diodes and diode-connected thin film transistors (TFTs), printed or patterned structures (e.g., circuitry) containing such diodes and TFTs, methods of making the same, and applications of the same for identification tags and sensors are disclosed. A patterned structure comprising a complementary pair of diodes or diode-connected TFTs in series can stabilize the threshold voltage (V_t) of a diode manufactured using printing or laser writing techniques. The present invention advantageously utilizes the separation between the V_t of an NMOS TFT (V_tn) and the V_t of a PMOS TFT (V_tp) to establish and/or improve stability of a forward voltage drop across a printed or laser-written diode. Further applications of the present invention relate to reference voltage generators, voltage clamp circuits, methods of controlling voltages on related or differential signal transmission lines, and RFID and EAS tags and sensors.

Claims

1. A circuit, comprising:

a) an NMOS diode having at least one printed or laser-written structure therein;

b) a PMOS diode having at least one printed or laser-written structure therein, the PMOS diode being in series with the NMOS diode between first and second complementary nodes or first and second signal lines of a differential signal path; and

c) a metal wire connecting the NMOS diode to the PMOS diode in series.

2. The circuit of claim 1, wherein said NMOS diode comprises an NMOS thin film transistor (TFT) and said PMOS diode comprises a PMOS TFT.

3. The circuit of claim 2, wherein said metal wire electrically connects a gate and a source/drain region of said NMOS TFT with a gate and a source/drain region of said PMOS TFT.

4. The circuit of claim 1, wherein said NMOS diode comprises a first Schottky diode having a printed or laser-written n-doped semiconductor layer, and said PMOS diode comprises a second Schottky diode having a printed or laser-written p-doped semiconductor layer.

5. The circuit of claim 4, wherein said metal wire electrically connects said n-doped semiconductor layer and said p-doped semiconductor layer.

6. The circuit of claim 1, wherein said NMOS diode comprises an n-dope, semiconductor layer, and said PMOS diode comprises a p-doped semiconductor layer, each of said n-doped and p-doped semiconductor layers having a substantially uniform dopant distribution along substantially the entire thickness thereof while in an amorphous phase.

7. A clamp circuit, comprising a plurality of the circuits of claim 1, in series between said first and second complementary nodes.

8. The clamp circuit of claim 7, further comprising a shunt transistor having a gate receiving an output from one of said NMOS and PMOS diodes, a source coupled, to one of said first and second complementary nodes and a drain coupled to the other of said first and second complementary nodes.

9. The clamp circuit of claim 8, further comprising a resistor coupled between one of said first and second complementary nodes and the gate of the shunt transistor.

10. An alternating current clamp circuit, comprising:

a) a first circuit of claim 8, coupled between said first and second complementary nodes; and

b) a second circuit of claim 8, coupled between said first and second complementary nodes in parallel with said first circuit, but with a polarity opposite of said first circuit.

11. The alternating current clamp circuit of claim 10, wherein the first and second complementary nodes comprise a differential signal transmission line.

12. The circuit of claim 11, wherein the first and second nodes each comprise a printed or laser-patterned metal wire.

13. A high frequency (HF), ultrahigh frequency (UHF), radio frequency identification (RFID) or electronic article surveillance (EAS) device, comprising:

a) an antenna and/or inductor;

b) a rectifier, configured to convert a radio frequency signal received by said antenna and/or inductor into power;

c) the alternating current clamp circuit of claim 10, configured to limit a voltage of the radio frequency signal; and

d) logic configured to recover a clock signal from the radio frequency signal and generate an identification signal.

14. The device of claim 13, wherein the alternating current clamp circuit is coupled between first and second rectifier input nodes.

15. The circuit of claim 1, wherein the metal wire comprises a printed or laser-patterned metal wire.

16. A high frequency (HF), ultrahigh frequency (UHF), radio frequency identification (RFID) or electronic article surveillance (EAS) device, comprising:

a) an antenna and/or inductor;

b) rectifier comprising the circuit of claim 1;

c) an alternating current clamp circuit configured to limit a voltage of the radio frequency signal; and

d) logic configured to recover a clock signal from the radio frequency signal and generate an identification signal.

17. The circuit of claim 1, wherein said NMOS diode comprises a printed n-doped semiconductor layer, and said PMOS diode comprises a printed p-doped semiconductor layer.

18. The circuit of claim 1, wherein said NMOS diode comprises a laser-written n-doped semiconductor layer, and said PMOS diode comprises a laser-written p-doped semiconductor layer.

19. The circuit of claim 1, wherein one of said NMOS diode and said PMOS diode comprises a printed semiconductor layer, and the other of said NMOS diode and said PMOS diode comprises a laser-written semiconductor layer.

20. A circuit, comprising:

a) an NMOS diode having at least one printed or laser-written structure therein configured to receive a first voltage;

b) a PMOS diode having at least one printed or laser-written structure therein configured to receive a second voltage different from the first voltage; and

c) a metal wire connecting the NMOS diode to the PMOS diode in series,

wherein the circuit is configured to provide a relatively stable, constant output voltage between the first and second voltages.

21. The circuit of claim 20, wherein said NMOS diode comprises an NMOS thin film transistor (TFT) and said PMOS diode comprises a PMOS TFT.

22. A method of limiting a first voltage on a first lode, comprising:

a) receiving a signal on the first node; and

b) clamping the signal to a second voltage on a second node by passing current through the circuit of claim 21 when a difference between the first and second voltages exceeds a predetermined value.

23. The circuit of claim 21, wherein said metal wire electrically connects a gate and a source/drain region of said NMOS TFT with a gate and a source/drain region of said PMOS TFT.

24. The circuit of claim 20, wherein said NMOS diode comprises a first Schottky diode having an n-doped semiconductor layer, and said PMOS diode comprises a second Schottky diode having a p-doped semiconductor layer.

25. The circuit of claim 24, wherein said metal wire electrically connects said n-doped semiconductor layer and said p-doped semiconductor layer.

26. The circuit of claim 24, wherein said n-doped semiconductor layer comprises a first semiconductor layer having a first n-type dopant concentration, said first Schottky diode further comprises a second semiconductor layer thereon having a second n-type dopant concentration different from that of the first n-doped semiconductor layer, said p-doped semiconductor layer comprises a third semiconductor layer having a first p-type dopant concentration, and said second Schottky diode further comprises a fourth, semiconductor layer having a second p-type dopant concentration different from that of the first p-doped semiconductor layer.

27. A circuit, comprising:

a) an NMOS diode comprising a first metal layer and an n-doped semiconductor layer, having at least one structure therein formed from a first liquid phase ink containing a silane and/or silicon nanoparticles;

b) a PMOS diode comprising a second metal layer and a p-doped semiconductor layer, having at least one structure therein formed from a second liquid phase ink, the second liquid phase ink being the same as or different from the first liquid phase ink; and

c) a metal wire connecting the NMOS diode to the PMOS diode in series.

28. The circuit of claim 27, wherein said NMOS diode comprises an NMOS thin film transistor (TFT) and said PMOS diode comprises a PMOS TFT.

29. The circuit of claim 28, wherein said metal wire electrically connects a gate and a source/drain region of said NMOS TFT with a gate and a source/drain region of said PMOS TFT.

30. The circuit of claim 27, wherein said NMOS diode comprises a first Schottky diode having an n-doped semiconductor layer, and said PMOS diode comprises a second Schottky diode having a p-doped semiconductor layer.

31. The circuit of claim 30, wherein said metal wire electrically connects said n-doped semiconductor layer and said p-doped semiconductor layer.

32. The circuit of claim 30, wherein said n-doped semiconductor layer comprises a first semiconductor layer having a first n-type dopant concentration, said first Schottky diode further comprises a second semiconductor layer thereon having a second n-type dopant concentration different from that of the first n-doped semiconductor layer, said p-doped semiconductor layer comprises a third semiconductor layer having a first p-type dopant concentration, and said second Schottky diode further comprises a fourth semiconductor layer having a second p-type dopant concentration different from that of the first p-doped semiconductor layer.