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Integrated chip package structure using organic substrate and method of manufacturing the same

  • US 8,471,361 B2
  • Filed: 02/18/2011
  • Issued: 06/25/2013
  • Est. Priority Date: 12/31/2001
  • Status: Active Grant
First Claim
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1. A circuit component comprising:

  • an organic substrate;

    a die over said organic substrate, wherein said die comprises multiple active devices;

    a polymer layer over said organic substrate and in contact with at least one sidewall of said die;

    a glass substrate over said polymer layer, said die and said organic substrate, where a first opening in said glass substrate passes vertically through said glass substrate;

    a circuit device over said glass substrate; and

    a first interconnecting structure comprising a first portion in said first opening and a second portion over said glass substrate, wherein said second portion is connected to said die through said first portion.

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