Integrated chip package structure using organic substrate and method of manufacturing the same
First Claim
1. A circuit component comprising:
- an organic substrate;
a die over said organic substrate, wherein said die comprises multiple active devices;
a polymer layer over said organic substrate and in contact with at least one sidewall of said die;
a glass substrate over said polymer layer, said die and said organic substrate, where a first opening in said glass substrate passes vertically through said glass substrate;
a circuit device over said glass substrate; and
a first interconnecting structure comprising a first portion in said first opening and a second portion over said glass substrate, wherein said second portion is connected to said die through said first portion.
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Accused Products
Abstract
An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.
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Citations
32 Claims
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1. A circuit component comprising:
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an organic substrate; a die over said organic substrate, wherein said die comprises multiple active devices; a polymer layer over said organic substrate and in contact with at least one sidewall of said die; a glass substrate over said polymer layer, said die and said organic substrate, where a first opening in said glass substrate passes vertically through said glass substrate; a circuit device over said glass substrate; and a first interconnecting structure comprising a first portion in said first opening and a second portion over said glass substrate, wherein said second portion is connected to said die through said first portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A chip package comprising:
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an organic substrate; a die over said organic substrate, wherein said die comprises multiple active devices; a glass substrate over said die and said organic substrate, wherein a first opening in said glass substrate passes vertically through said glass substrate; a first interconnecting structure comprising a first portion in said first opening and a second portion over said glass substrate, wherein said second portion is connected to said die through said first portion; and a passive device over said glass substrate, wherein said passive device comprises a comb-shaped capacitor. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification