Coil device

• US 8,471,668 B2
• Filed: 07/11/2011
• Issued: 06/25/2013
• Est. Priority Date: 07/23/2010
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: Hsieh, Roger, Lee, Cheng-Chang, Liu, Chun-Tiao
• Primary Examiner(s): NGUYEN, TUYEN T
• Application Number:
  US13/179,884
• Publication Number:
  US 20120019343A1
• Time in Patent Office: 715 Days
• Field of Search: 336/65, 336/83, 336/192, 336/200, 336206-208, 336/232
• US Class Current: 336/200
• CPC Class Codes: B65D 83/206 comprising a cantilevered actuator element, e.g. a lever pivoting about a living hinge
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/04 with magnetic core

Abstract

A coil device includes a first coil pattern, a second coil pattern, an insulating layer, a magnetic covering element and a number of conductive pillars. The second coil pattern is disposed above the first coil pattern, and is spaced apart from the first coil pattern. The insulating layer covers the first coil pattern and the second coil pattern and defines an opening surrounded by the first coil pattern and the second coil pattern. The magnetic covering element covers the insulating layer and extends into the opening. The conductive pillars are disposed within the magnetic covering element and are exposed from a bottom side of the magnetic covering element. A portion of the conductive pillars are electrically connected to the first coil pattern, and another portion of the conductive pillars are connected to the second coil pattern. The coil device can be easily manufactured.

Claims

1. A coil device comprising:

a first coil pattern;

a second coil pattern disposed above the first coil pattern and spaced apart from the first coil pattern;

an insulating layer covering the first coil pattern and the second coil pattern, the insulating layer defining an opening surrounded by the first coil pattern and the second coil pattern;

a magnetic covering element covering the insulating layer and extending into the opening; and

a plurality of conductive pillars disposed within the magnetic covering element, wherein sidewalls of the conductive pillars are entirely covered by the magnetic covering element and at least an end of each of the conductive pillars is exposed from a bottom side of the magnetic covering element, a portion of the conductive pillars are electrically connected to the first coil pattern and another portion of the conductive pillars are electrically connected to the second coil pattern.

2. The coil device as claimed in claim 1, wherein the magnetic covering element comprises:

a magnetic substrate comprising a carrying side and a bottom side opposite to the carrying side, wherein the bottom side of the magnetic substrate is the bottom side of the magnetic covering element, the insulating layer is disposed at the carrying side, and the conductive pillars are disposed within the magnetic substrate; and

a magnetic cover covering the carrying side and the insulating layer.

3. The coil device as claimed in claim 2 further comprising a plurality of conductive wires, wherein the first coil pattern and the second coil pattern are electrically connected to the corresponding conductive pillars via the conductive wires.

4. The coil device as claimed in claim 3, wherein the conductive wires is embedded into the magnetic substrate, and each of the conductive wires comprises a surface that is located in a same reference plane with the carrying side of the magnetic substrate.

5. The coil device as claimed in claim 3, wherein the conductive wires are embedded into the magnetic cover.

6. The coil device as claimed in claim 2 further comprising a plurality of electrodes disposed at the bottom side of the magnetic substrate and electrically connected to the conductive pillars.

7. The coil device as claimed in claim 6, wherein the electrodes are embedded into the magnetic substrate and each of the electrodes comprises a surface that is located in a same reference plane with the bottom side of the magnetic substrate.

8. The coil device as claimed in claim 1 further comprising:

a plurality of conductive wires disposed within the magnetic covering element, wherein the first coil pattern and the second coil pattern are electrically connected to corresponding conductive pillars via the conductive wires; and

a plurality of electrodes disposed at the bottom side of the magnetic covering element and electrically connected to the conductive pillars.

9. The coil device as claimed in claim 8, wherein the electrodes are embedded into the magnetic covering element, and each of the electrodes comprises a surface that is located in a same reference plane with the bottom side of the magnetic covering element.

10. The coil device as claimed in claim 1, wherein the magnetic covering element is formed in one piece.

11. The coil device as claimed in claim 1, wherein a weight ratio of magnetic powder of the magnetic covering element is in a range from 75% to 95%, and effective permeability of the magnetic covering element is greater than 4.

12. A coil device comprising:

an insulating layer;

a plurality of coil patterns stacked in the insulating layer, and the coil patterns being spaced apart from each other by the insulating layer;

a magnetic covering element covering the insulating layer; and

a plurality of conductive pillars disposed within the magnetic covering element and electrically connected to the corresponding coil patterns, wherein sidewalls of the conductive pillars are entirely covered by the magnetic covering element and at least an end of each of the conductive pillars is exposed from a bottom side of the magnetic covering element.

13. The coil device as claimed in claim 12, wherein the magnetic covering element comprising:

a magnetic substrate comprising a carrying side and a bottom side opposite to the carrying side, wherein the bottom side of the magnetic substrate is the bottom side of the magnetic covering element, the insulating layer is disposed at the carrying side, and the conductive pillars are disposed within the magnetic substrate; and

a magnetic cover covering the carrying side and the insulating layer.

14. The coil device as claimed in claim 13 further comprising a plurality of conductive wires, wherein the coil patterns are electrically connected to the corresponding conductive pillars via the conductive wires.

15. The coil device as claimed in claim 14, wherein the conductive wires are embedded into the magnetic substrate, and each of the conductive wires comprises a surface that is located in a same reference plane with the carrying side.

16. The coil device as claimed in claim 14, wherein the conductive wires are embedded into the magnetic cover.

17. The coil device as claimed in claim 12 further comprising:

a plurality of conductive wires disposed within the magnetic covering element, wherein the coil patterns are electrically connected to the corresponding conductive pillars via the conductive wires; and

a plurality of electrodes disposed at the bottom side of the magnetic covering element and electrically connected to the conductive pillars, respectively.

18. The coil device as claimed in claim 12, wherein the magnetic covering element is formed in one piece.

19. The coil device as claimed in claim 12, wherein a weight ratio of magnetic powder in the magnetic covering element is in a range from 75% to 95%, and effective permeability of the magnetic covering element is greater than 4.

20. A coil device comprising:

an insulating layer formed in a ring shape;

a plurality of coil patterns stacked in the insulating layer, and the coil patterns being spaced apart from each other by the insulating layer;

a magnetic covering element consisting of a magnetic substrate and a magnetic cover, the magnetic substrate comprising a carrying side and a bottom side opposite to the carrying side, the insulating layer being disposed at the carrying side and in contact with the carrying side, the magnetic cover entirely covering the carrying side and the insulating layer, and the insulating layer being entirely covered by the magnetic covering element;

a plurality of conductive pillars disposed within the magnetic substrate and electrically connected to the corresponding coil patterns, and sidewalls of the conductive pillars being entirely covered by the magnetic covering element and at least an end of each of the conductive pillars being exposed from a bottom side of the magnetic substrate;

a plurality of conductive wires disposed within the magnetic covering element, and the coil patterns being electrically connected to the corresponding conductive pillars via the conductive wires; and

a plurality of electrodes disposed at the bottom side of the magnetic substrate and the electrodes being electrically connected to the conductive pillars, respectively.

21. The coil device as claimed in claim 20, wherein the conductive pillar is formed on a lead frame having the electrodes.