Miniature MEMS condenser microphone package and fabrication method thereof

• US 8,472,648 B2
• Filed: 06/11/2010
• Issued: 06/25/2013
• Est. Priority Date: 01/20/2009
• Status: Active Grant

• Current Assignee: Neomems Technologies, Inc.
• Original Assignee: General Motors Corporation (Motors Liquidation Co. GUC Trust)
• Inventors: Wang, Yunlong, Chen, Yi-Wen
• Primary Examiner(s): Ni, Suhan
• Application Number:
  US12/813,730
• Publication Number:
  US 20100246877A1
• Time in Patent Office: 1,110 Days
• Field of Search: 381174-176, 381/369, 381/191.17, 381/180, 367/170, 367/180
• US Class Current: 381/175
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H01L 2924/16151 Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a casing with a conductive part disposed over a substrate, to enclose a cavity. A MEMS acoustic sensing element and an IC chip are disposed inside the cavity. An opening with an acoustic passage connects the cavity to an ambient space. A first ground pad is disposed on a backside of the substrate connecting to the conductive part of the casing through a via hole of the substrate. A second ground pad is disposed on the backside of the substrate connecting to the MEMS acoustic sensing element or the IC chip through an interconnection of the substrate, wherein the first ground pad and the second ground pad are isolated from each other.

Claims

1. A MEMS microphone package, comprising:

a casing with a conductive part disposed over a substrate, to enclose a cavity;

a MEMS acoustic sensing element and an IC chip disposed inside the cavity;

an opening comprising an acoustic passage connecting the cavity to an ambient space;

a first ground pad disposed on a backside of the substrate connecting to the conductive part of the casing through a via hole of the substrate; and

a second ground pad disposed on the backside of the substrate connecting to the MEMS acoustic sensing element or the IC chip through an interconnection of the substrate,

wherein the first ground pad and the second ground pad are isolated from each other.

2. The MEMS microphone package as claimed in claim 1, wherein the substrate is soldered onto a PCB mother board, wherein the first and second ground pads are soldered to a common ground pad on the PCB mother board.

3. The MEMS microphone package as claimed in claim 1, wherein the substrate is soldered onto a PCB mother board, wherein the first and second ground pads are soldered to respective different ground pads on the PCB mother board.

4. The MEMS microphone package as claimed in claim 1, wherein the casing is a unitary metal casing.

5. The MEMS microphone package as claimed in claim 1, wherein the casing is a multilayered casing including a top cover part and a housing wall part surrounding and supporting the top cover part.

6. The MEMS microphone package as claimed in claim 5, wherein the multilayered casing comprises a conductive layer sandwiched between two non-conductive layers.

7. The MEMS microphone package as claimed in claim 5, further comprising an acoustic absorption layer lining the multilayered casing.

8. The MEMS microphone package as claimed in claim 1, wherein the opening is formed in and extended through the casing to allow acoustic signals to pass therethrough.

9. The MEMS microphone package as claimed in claim 2, wherein the opening is formed in and extended through the substrate, wherein an acoustic opening formed in and extended through the PCB mother board is aligned with the opening to allow acoustic signals to pass therethrough.

10. The MEMS microphone package as claimed in claim 9, wherein the MEMS acoustic sensing element is disposed on one end of the opening.

11. The MEMS microphone package as claimed in claim 10, further comprising a perforated plate interposed between the one end of the opening and the MEMS acoustic sensing element.

12. The MEMS microphone package as claimed in claim 9, further comprising an acoustic sealer surrounds the opening and is interposed between the substrate and the PCB mother board.

13. The MEMS microphone package as claimed in claim 1, further comprising at least one passive element disposed inside the cavity.