LED backlight module structure for increasing process yield

• US 8,475,031 B1
• Filed: 01/03/2012
• Issued: 07/02/2013
• Est. Priority Date: 01/03/2012
• Status: Expired due to Fees

• Current Assignee: Kocam International Company Limited
• Original Assignee: Kocam International Company Limited
• Inventors: Chen, Tsan-Jung
• Primary Examiner(s): WALFORD, NATALIE K
• Application Number:
  US13/342,321
• Publication Number:
  US 20130170249A1
• Time in Patent Office: 546 Days
• Field of Search: None
• US Class Current: 362/612
• CPC Class Codes: G02B 6/0055 Reflecting element, sheet or layer
• CPC Class Codes: G02B 6/0083 Details of electrical connections of light sources to drivers, circuit boards, or the like
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: G02B 6/009 of the light source in the package G02B6/0021 takes precedence

Abstract

LED backlight module structure for increasing process yield comprises a housing, a copper circuit layer, a plurality of LED chips, a plurality of solder paste overflow prevention members, a light guide plate, and a bottom reflector. In the present invention, it mainly disposed the solder paste overflow prevention members between the LED chips and the copper circuit layer, therefore, the solder paste overflow phenomenon is prevented when using a pressing fixture to assist in executing the welding process of LED chips, and it ensures that the soldering pins of the LED chips would not electrically connect to each other due to the solder paste overflow phenomenon. Moreover, a position limiting band can be further disposed on the copper circuit layer for receiving and fixing the LED chips, in addition, the position limiting band is helpful to the LED chips in heat dissipation when the LED chips emit light.

Claims

1. An Light-emitting diode (LED) backlight module structure for increasing process yield, comprising:

a housing;

a copper circuit layer, being disposed on the surface of a circuit-disposing portion of the housing through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;

a plurality of LED chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of LED chips are disposed on the copper circuit layer, and the soldering pins being welded to the soldering points;

a plurality of solder paste overflow prevention members, being disposed between the LED chips and the copper circuit layer;

a light guide plate, being disposed in the housing, and a light-receiving surface of the light guide plate being opposite to the light-emitting surfaces of the LED chips; and

a bottom reflector, being disposed on the bottom of the light guide plate for preventing light leakage.

2. The LED backlight module structure for increasing process yield of claim 1, further comprising:

a reflector, being disposed on the surface of the copper circuit layer and having a plurality of LED through holes for pass of the LED chips.

3. The LED backlight module structure for increasing process yield of claim 1, wherein the solder paste overflow prevention member comprises a bar-shaped solder paste overflow prevention member and four block-shaped solder paste overflow prevention members.

4. The LED backlight module structure for increasing process yield of claim 1, further comprising:

a position limiting band, being disposed on the solder paste overflow prevention members and comprising;

a plurality of position limiting holes, for receiving and fixing the LED chips; and

a plurality of avoiding recesses, being formed on the bottom of the inner wall of each position limiting hole pairwise.

5. The LED backlight module structure for increasing process yield of claim 3, wherein the one bar-shaped solder paste overflow prevention member and the four block-shaped solder paste overflow prevention members may be integratedly formed to one H-shaped solder paste overflow prevention member.

6. The LED backlight module structure for increasing process yield of claim 1, wherein the housing is selected from the group consisting of:

sheet metal housing and extrusion housing.

7. The LED backlight module structure for increasing process yield of claim 6, wherein the appearance of the said sheet metal housing is selected from the group consisting of:

“

”

shape and “

L”

shape.

8. The LED backlight module structure for increasing process yield of claim 1, wherein the material for making the solder paste overflow prevention member is selected from the group consisting of:

heat-resistant adhesive tape, acrylic, silicone, and epoxy resin.

9. The LED backlight module structure for increasing process yield of claim 1, further comprising:

a circuit substrate, being disposed on the circuit-disposing portion of the housing for bearing and carrying the thermally conductive insulating layer and the copper circuit layer.

10. The LED backlight module structure for increasing process yield of claim 9, wherein the material for making the circuit substrate is selected from the group consisting of:

aluminum and fiberglass.

16. The LED backlight module structure for increasing process yield of claim 1, wherein the housing is selected from the group consisting of:

sheet metal housing and extrusion housing.

17. The LED backlight module structure for increasing process yield of claim 16, wherein the appearance of the said sheet metal housing is selected from the group consisting of:

“

”

shape and “

L”

shape.

25. The LED backlight module structure for increasing process yield of claim 1, wherein the housing is selected from the group consisting of:

sheet metal housing and extrusion housing.

26. The LED backlight module structure for increasing process yield of claim 25, wherein the appearance of the said sheet metal housing is selected from the group consisting of:

“

”

shape and “

L”

shape.

11. An Light-emitting diode (LED) backlight module structure for increasing process yield, comprising:

a housing, having at least one circuit-disposing portion, and the circuit-disposing portion having a plurality of disposing holes;

a circuit substrate;

a copper circuit layer, being disposed on the surface of the circuit substrate through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;

a plurality of LED chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of LED chips are disposed on the copper circuit layer, and the soldering pins being welded to the soldering points;

moreover, the circuit substrate being attached to the outer surface of the circuit-disposing portion via another thermally conductive insulating layer, such that the LED chips respectively pass through the disposing holes and enter the interior of the housing from the outer surface of the circuit-disposing portion;

a plurality of solder paste overflow prevention members, being disposed between the LED chips and the copper circuit layer;

a light guide plate, being disposed in the housing, and a light-receiving surface of the light guide plate being opposite to the light-emitting surfaces of the LED chips; and

a bottom reflector, being disposed on the bottom of the light guide plate for preventing light leakage.

12. The LED backlight module structure for increasing process yield of claim 11, further comprising:

a reflector, being disposed on the surface of the copper circuit layer and having a plurality of LED through holes for pass of the LED chips.

13. The LED backlight module structure for increasing process yield of claim 11, wherein the solder paste overflow prevention member comprises a bar-shaped solder paste overflow prevention member and four block-shaped solder paste overflow prevention members.

14. The LED backlight module structure for increasing process yield of claim 11, further comprising:

a position limiting band, being disposed on the solder paste overflow prevention members and comprising;

a plurality of position limiting holes, for receiving and fixing the LED chips; and

a plurality of avoiding recesses, being formed on the bottom of the inner wall of each position limiting hole pairwise.

15. The LED backlight module structure for increasing process yield of claim 13, wherein the one bar-shaped solder paste overflow prevention member and the four block-shaped solder paste overflow prevention members may be integratedly formed to one H-shaped solder paste overflow prevention member.

18. The LED backlight module structure for increasing process yield of claim 11, wherein the material for making the solder paste overflow prevention member is selected from the group consisting of:

heat-resistant adhesive tape, acrylic, silicone, and epoxy resin.

19. The LED backlight module structure for increasing process yield of claim 11, wherein the material for making the circuit substrate is selected from the group consisting of:

aluminum and fiberglass.

20. An Light-emitting diode (LED) backlight module structure for increasing process yield, comprising:

a housing;

a copper circuit layer, being disposed on the surface of a circuit-disposing portion of the housing through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;

a plurality of LED chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of LED chips are disposed on the copper circuit layer, and the soldering pins being welded to the soldering points;

a position limiting band, being disposed on the copper circuit layer via another thermally conductive insulating layer, wherein the another thermally conductive insulating layer has a plurality of openings for exposing the soldering points of the copper circuit layer, and the position limiting band comprising;

a plurality of position limiting holes, for receiving and fixing the LED chips; and

a plurality of avoiding recesses, being formed on the bottom of the inner wall of each position limiting hole pairwise;

a light guide plate, being disposed in the housing, and a light-receiving surface of the light guide plate being opposite to the light-emitting surfaces of the LED chips; and

a bottom reflector, being disposed on the bottom of the light guide plate for preventing light leakage.

21. The LED backlight module structure for increasing process yield of claim 20, further comprising:

a reflector, being disposed on the surface of the copper circuit layer and having a plurality of LED through holes for pass of the LED chips.

22. The LED backlight module structure for increasing process yield of claim 20, further comprising:

a plurality of solder paste overflow prevention members, being disposed between the LED chips and the copper circuit layer.

23. The LED backlight module structure for increasing process yield of claim 22, wherein the solder paste overflow prevention member comprises a bar-shaped solder paste overflow prevention member and four block-shaped solder paste overflow prevention members.

24. The LED backlight module structure for increasing process yield of claim 23, wherein the one bar-shaped solder paste overflow prevention member and the four block-shaped solder paste overflow prevention members may be integratedly formed to one H-shaped solder paste overflow prevention member.

27. The LED backlight module structure for increasing process yield of claim 22, wherein the material for making the solder paste overflow prevention member is selected from the group consisting of:

heat-resistant adhesive tape, acrylic, silicone, and epoxy resin.

28. The LED backlight module structure for increasing process yield of claim 20, further comprising:

a circuit substrate, being disposed on the circuit-disposing portion of the housing for bearing and carrying the thermally conductive insulating layer and the copper circuit layer.

29. The LED backlight module structure for increasing process yield of claim 28, wherein the material for making the circuit substrate is selected from the group consisting of:

aluminum and fiberglass.

30. An Light-emitting diode (LED) backlight module structure for increasing process yield, comprising:

a housing, having at least one circuit-disposing portion, and the circuit-disposing portion having a plurality of disposing holes;

a circuit substrate;

a copper circuit layer, being disposed on the surface of the circuit substrate through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;

a plurality of LED chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of LED chips are disposed on the copper circuit layer, and the soldering pins being welded to the soldering points;

moreover, the circuit substrate being attached to the outer surface of the circuit-disposing portion via another thermally conductive insulating layer, such that the LED chips respectively pass through the disposing holes and enter the interior of the housing from the outer surface of the circuit-disposing portion;

a position limiting band, being disposed on the copper circuit layer via another thermally conductive insulating layer, wherein the another thermally conductive insulating layer has a plurality of openings for exposing the soldering points of the copper circuit layer, and the position limiting band comprising;

a plurality of position limiting holes, for receiving and fixing the LED chips; and

a plurality of avoiding recesses, being formed on the bottom of the inner wall of each position limiting hole pairwise;

a light guide plate, being disposed in the housing, and a light-receiving surface of the light guide plate being opposite to the light-emitting surfaces of the LED chips; and

a bottom reflector, being disposed on the bottom of the light guide plate for preventing light leakage.

31. The LED backlight module structure for increasing process yield of claim 30, further comprising:

a reflector, being disposed on the surface of the copper circuit layer and having a plurality of LED through holes for pass of the LED chips.

32. The LED backlight module structure for increasing process yield of claim 30, further comprising:

a plurality of solder paste overflow prevention members, being disposed between the LED chips and the copper circuit layer.

33. The LED backlight module structure for increasing process yield of claim 32, wherein the solder paste overflow prevention member 17 comprises a bar-shaped solder paste overflow prevention member and four block-shaped solder paste overflow prevention members.

34. The LED backlight module structure for increasing process yield of claim 33, wherein the one bar-shaped solder paste overflow prevention member and the four block-shaped solder paste overflow prevention members may be integratedly formed to one H-shaped solder paste overflow prevention member.

35. The LED backlight module structure for increasing process yield of claim 30, wherein the housing is selected from the group consisting of:

sheet metal housing and extrusion housing.

36. The LED backlight module structure for increasing process yield of claim 35, wherein the appearance of the said sheet metal housing is selected from the group consisting of:

“

”

shape and “

L”

shape.

37. The LED backlight module structure for increasing process yield of claim 32, wherein the material for making the solder paste overflow prevention member is selected from the group consisting of:

heat-resistant adhesive tape, acrylic, silicone, and epoxy resin.

38. The LED backlight module structure for increasing process yield of claim 30, wherein the material for making the circuit substrate is selected from the group consisting of:

aluminum and fiberglass.