Patterning of thin film layers
First Claim
1. A method comprising:
- depositing a first conductive layer onto a surface;
patterning a dielectric layer on the first conductive layer;
patterning the first conductive layer using the patterned dielectric layer as a first mask;
depositing a second conductive layer onto the patterned dielectric layer;
patterning a passivation layer on the second conductive layer; and
patterning the second conductive layer using the patterned passivation layer as a second mask.
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Abstract
Simplified patterning of layers of a thin film is disclosed. In some embodiments, the patterning can include patterning a first conductive layer using a patterned dielectric layer as a mask and patterning a second conductive layer using a patterned passivation layer as another mask. In other embodiments, the patterning can include patterning a first conductive layer using a removable photosensitive layer as a mask, patterning a black mask layer using a removable photo mask, and patterning a second conductive layer using a patterned passivation layer as another mask. In still other embodiments, the patterning can include patterning a first conductive layer using a patterned black mask layer as a mask and patterning a second conductive layer using a patterned passivation layer as another mask. An exemplary device utilizing the thin film so patterned can include a touch sensor panel.
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Citations
18 Claims
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1. A method comprising:
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depositing a first conductive layer onto a surface; patterning a dielectric layer on the first conductive layer; patterning the first conductive layer using the patterned dielectric layer as a first mask; depositing a second conductive layer onto the patterned dielectric layer; patterning a passivation layer on the second conductive layer; and patterning the second conductive layer using the patterned passivation layer as a second mask. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method comprising:
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depositing a first conductive layer onto a surface; patterning a removable photosensitive layer on the first conductive layer; patterning the first conductive layer using the patterned photosensitive layer as a first mask; patterning a black mask layer onto the patterned first conductive layer using a removable second mask; depositing a second conductive layer onto the patterned black mask layer; patterning a passivation layer on the second conductive layer; and patterning the second conductive layer using the patterned passivation layer as a third mask. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method comprising:
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depositing a first conductive layer onto a surface; patterning a black mask layer on the first conductive layer; patterning the first conductive layer using the patterned black mask layer as a first mask; depositing a second conductive layer onto the patterned black mask layer; patterning a passivation layer on the second conductive layer; and patterning the second conductive layer using the patterned passivation layer as a second mask. - View Dependent Claims (17, 18)
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Specification