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Method and structure of sensors or electronic devices using vertical mounting

  • US 8,476,084 B1
  • Filed: 05/23/2011
  • Issued: 07/02/2013
  • Est. Priority Date: 05/24/2010
  • Status: Active Grant
First Claim
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1. A method for fabricating an integrated device, the method comprising:

  • providing a substrate having a surface region;

    forming at least one integrated device provided on a first region overlying the surface region, the at least one integrated device having at least one contact region, the first region having a first surface region, the at least one integrated device including one or more sensors and/or one or more electronic devices;

    forming at least one trench structure within at least one portion of the first region;

    forming a dielectric material overlying the first region and the at least one trench structure;

    removing at least one portion of the dielectric material within a vicinity of the at least one contact region;

    forming a conduction material overlying the dielectric material, the at least one trench structure, and the at least one contact region;

    removing at least one portion of the conduction material within a vicinity of the at least one contact region and the at least one trench structure to form at least one bonding structure;

    singulating the resulting device within a vicinity of the at least one bonding structure to form at least one singulated integrated device having at least one vertical bond pad;

    coupling the at least one singulated integrated device to a package, the package having a package surface region, the at least one singulated device being coupled to the package surface region such that the at least one vertical bond pad is configured horizontally; and

    forming at least one interconnection between the at least one vertical bond pad and at least a portion of the package surface region.

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