×

High voltage low current surface emitting LED

  • US 8,476,668 B2
  • Filed: 06/11/2010
  • Issued: 07/02/2013
  • Est. Priority Date: 04/06/2009
  • Status: Active Grant
First Claim
Patent Images

1. A LED chip, comprising:

  • a plurality of sub-LEDs collectively bonded by a common bond layer to a submount, wherein the common bond layer does not electrically interconnect the plurality of sub-LEDs;

    electrically conductive and electrically insulating features serially interconnecting said sub-LEDs; and

    at least one via arranged to electrically couple at least one of said sub-LEDs to said submount.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×