Corner layout for superjunction device

• US 8,476,698 B2
• Filed: 02/19/2010
• Issued: 07/02/2013
• Est. Priority Date: 02/19/2010
• Status: Active Grant

• Current Assignee: Alpha & Omega Semiconductor, Ltd.
• Original Assignee: Alpha & Omega Semiconductor, Ltd.
• Inventors: Guan, Lingpeng, Bhalla, Anup, Zhu, Tinggang, Bobde, Madhur
• Primary Examiner(s): WOJCIECHOWICZ, EDWARD JOSEPH
• Application Number:
  US12/709,114
• Publication Number:
  US 20110204442A1
• Time in Patent Office: 1,229 Days
• Field of Search: 257/328, 257/342, 257/487, 257/E29.008, 257/E29.256, 716/118
• US Class Current: 257/328
• CPC Class Codes: H01L 29/0634 Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
• CPC Class Codes: H01L 29/0638 for preventing surface leakage due to surface inversion layer, e.g. with channel stopper channel stoppers in combination with isolation region for integrated circuits H01L21/762
• CPC Class Codes: H01L 29/0696 of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
• CPC Class Codes: H01L 29/1095 Body region, i.e. base region, of DMOS transistors or IGBTs cell layout H01L29/0696
• CPC Class Codes: H01L 29/402 Field plates
• CPC Class Codes: H01L 29/404 Multiple field plate structures
• CPC Class Codes: H01L 29/47 Schottky barrier electrodes H01L29/435 takes precedence
• CPC Class Codes: H01L 29/7811 with an edge termination structure guard regions per se H01L29/0619; field plates per se H01L29/402
• CPC Class Codes: H01L 29/7823 with an edge termination structure guard regions per se H01L29/0619; field plates per se H01L29/402

Abstract

A superjunction device and methods for layout design and fabrication of a superjunction device are disclosed. A layout of active cell column structures can be configured so that a charge due to first conductivity type dopants balances out charge due to second conductivity type dopants in a doped layer in an active cell region. A layout of end portions of the active cell column structures proximate termination column structures can be configured so that a charge due to the first conductivity type dopants in the end portions and a charge due to the first conductivity type dopants in the termination column structures balances out charge due to the second conductivity type dopants in a portion of the doped layer between the termination column structures and the end portions.

Claims

1. A method for layout design of a superjunction device, the method comprising:

a) determining dose Q_imp of first conductivity type dopants to be doped per unit area in active cell column structures of an active cell region formed in a doped layer of the superjunction device and in termination column structures of a termination region formed in the doped layer and surrounding the active cell region, wherein the doped layer is characterized by a thickness t and a dopant density M of second conductivity type dopants per unit volume of an opposite charge type to the first conductivity type dopants;

b) configuring a layout of the active cell column structures so that a charge due to the first conductivity type dopants balances out charge due to the second conductivity type dopants in the doped layer in the active cell region; and

c) configuring a corner layout of end portions of the active cell column structures proximate the termination column structures so that a charge due to the first conductivity type dopants in the end portions and a charge due to the first conductivity type dopants in the termination column structures balances out charge due to the second conductivity type dopants in a corner region of the superjunction device, wherein configuring a corner layout of the end portions includes adjusting a configuration of a layout of end portions of active cell column structures proximate a corner of the termination column structures to take into account a curvature of the corner, wherein adjusting the configuration of the layout of the end portions includes dividing a portion of the doped layer proximate the corner into one or more regions of area A and laying out the end portions of the active cell column structures at the corner such that each of the one or more regions of area A includes an area A1 containing termination column and/or active cell column structures of first conductivity type dopants such that, for each of the one or more regions of area A, A1/A is equal to a predetermined value, wherein the layout of the end portions of one or more of the active cell column structures proximate the corner includes a hooked portion, wherein the hooked portion bends toward a side closest to a center of a die on which the superjunction device is formed.

2. The method of claim 1, wherein adjusting the configuration of the end portions includes adjusting a distance between one or more of the end portions and a nearby termination column structure.

5. The method of claim 1 where the predetermined A1/A value is equal to M·

t/Q_imp.

3. A superjunction device comprising:

a doped layer;

an active cell region having a plurality of active cell column structures formed in the doped layer; and

a termination region having one or more termination column structures formed in the doped layer surrounding the active cell region,

wherein the active cell column structures and termination column structures are characterized by a dose Q_imp of first conductivity type dopants, wherein the doped layer is characterized by a thickness t and a dopant density M of second conductivity type dopants per unit volume of an opposite charge type to the first conductivity type dopants;

wherein a layout of the column structures in an active cell region is configured so that a charge due to the first conductivity type dopants balances out charge due to the second conductivity type dopants in the doped layer in the active cell region,

wherein a corner layout of end portions of the column structures of the active cell region proximate the termination column structures is configured so that a charge due to the first conductivity type dopants in the end portions and a charge due to the first conductivity type dopants in the termination column structures balances out charge due to the second-type dopants in the adjacent portions of the doped layer, wherein a configuration of a layout of end portions of active cell column structures proximate a corner of the termination column structures takes into account a curvature of the corner, wherein a portion of the doped layer proximate the corner is divided into one or more regions of area A and the end portions of the active cell column structures at the corner are laid out such that each of the one or more regions of area A includes an area A1 containing termination column and/or active cell column structures of first conductivity type dopants such that, for each of the one or more regions of area A, A1/A is equal to a predetermined value, wherein the layout of the end portions of one or more of the active cell column structures proximate the corner includes a hooked portion, wherein the hooked portion bends toward a side closest to a center of a die on which the superjunction device is formed, wherein the hooked portion bends toward a side closest to a center of a die on which the superjunction device is formed.

4. The device of claim 3, wherein the configuration of the end portions is characterized by a varied distance between one or more of the end portions and a nearby termination column structure.

6. The device of claim 3 wherein the A1/A constant is equal to M·

t/Q_imp.