×

Microelectromechanical systems (MEMS) resonators and related apparatus and methods

  • US 8,476,809 B2
  • Filed: 05/08/2012
  • Issued: 07/02/2013
  • Est. Priority Date: 04/29/2008
  • Status: Active Grant
First Claim
Patent Images

1. A packaged micromechanical resonator, comprising:

  • a substrate;

    a cap lacking integrated circuitry;

    a first portion of an electrically conductive material between the substrate and the cap, disposed such that the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume;

    a micromechanical resonator comprising a piezoelectric material disposed within the enclosed volume; and

    a second portion of the electrically conductive material between the substrate and the cap and configured to conduct a signal between the micromechanical resonator and the cap.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×