Microelectromechanical systems (MEMS) resonators and related apparatus and methods

• US 8,476,809 B2
• Filed: 05/08/2012
• Issued: 07/02/2013
• Est. Priority Date: 04/29/2008
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Sand 9, Inc. (Analog Devices, Inc.)
• Inventors: Chen, David M., Kuypers, Jan H., Mohanty, Pritiraj, Schoepf, Klaus Juergen, Zolfagharkhani, Guiti, Goodelle, Jason, Rebel, Reimund
• Primary Examiner(s): DOUGHERTY, THOMAS M
• Application Number:
  US13/466,767
• Publication Number:
  US 20120280594A1
• Time in Patent Office: 420 Days
• Field of Search: 310/340, 310/344, 310/346, 310/348, 331/68, 331/107.A, 331/154
• US Class Current: 310/344
• CPC Class Codes: B81B 3/0018 Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H02N 1/006 of the gap-closing type H02N1/004 takes precedence
• CPC Class Codes: H03H 2009/241 Bulk-mode MEMS resonators
• CPC Class Codes: H03H 3/007 for the manufacture of electromechanical resonators or networks
• CPC Class Codes: H03H 9/02007 of bulk acoustic wave devices
• CPC Class Codes: H03H 9/02244 of microelectro-mechanical resonators
• CPC Class Codes: H03H 9/02535 of surface acoustic wave devices
• CPC Class Codes: H10N 30/88 Mounts; Supports; Enclosures; Casings

Abstract

Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Claims

1. A packaged micromechanical resonator, comprising:

a substrate;

a cap lacking integrated circuitry;

a first portion of an electrically conductive material between the substrate and the cap, disposed such that the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume;

a micromechanical resonator comprising a piezoelectric material disposed within the enclosed volume; and

a second portion of the electrically conductive material between the substrate and the cap and configured to conduct a signal between the micromechanical resonator and the cap.

2. The packaged micromechanical resonator of claim 1, wherein the micromechanical resonator is configured to support Lamb waves.

3. The packaged micromechanical resonator of claim 1, wherein micromechanical resonator comprises a piezoelectric material.

4. The packaged micromechanical resonator of claim 1, wherein the cap includes one or more thru vias formed therein.

5. The packaged micromechanical resonator of claim 1, wherein the cap is formed of an insulating material.

6. The packaged micromechanical resonator of claim 1, wherein the first portion of the electrically conductive material and the second portion of the electrically conductive material are arranged in a side-by-side configuration.

7. The packaged micromechanical resonator of claim 1, wherein the first portion of the electrically conductive material and the second portion of the electrically conductive material are disposed within a same plane.

8. The packaged micromechanical resonator of claim 1, wherein the first portion of the electrically conductive material forms a substantially closed contour, and wherein the second portion of the electrically conductive material is disposed within the substantially closed contour.

9. The packaged micromechanical resonator of claim 8, wherein the second portion of the electrically conductive material does not form a closed contour.

10. The packaged micromechanical resonator of claim 8, wherein the second portion of the electrically conductive material comprises a pillar contacting the substrate and the cap.

11. The packaged micromechanical resonator of claim 1, wherein the first portion of the electrically conductive material contacts both the substrate and the cap.

12. The packaged micromechanical resonator of claim 11, wherein the second portion of the electrically conductive material contacts both the substrate and the cap.

13. The packaged micromechanical resonator of claim 1, wherein the second portion of the electrically conductive material contacts both the substrate and the cap.

14. The packaged micromechanical resonator of claim 1, wherein the micromechanical resonator comprises a piezoelectric material, wherein the cap includes one or more thru vias formed therein, and wherein the first portion of the electrically conductive material and the second portion of the electrically conductive material are arranged in a side-by-side configuration.

15. The packaged micromechanical resonator of claim 14, wherein the micromechanical resonator is configured to support Lamb waves.

16. The packaged micromechanical resonator of claim 1, wherein the micromechanical resonator comprises a piezoelectric material, wherein the cap includes one or more thru vias formed therein, and wherein the first portion of the electrically conductive material and the second portion of the electrically conductive material are disposed within a same plane.

17. The packaged micromechanical resonator of claim 16, wherein the micromechanical resonator is configured to support Lamb waves.