LED lighting system
First Claim
1. A method of manufacturing an LED lighting system, comprising:
- mounting a front end power supply on a substrate;
extending electrical leads from the power supply;
over-molding the front end power supply with a reactive injection molding process; and
electrically coupling an extended electrical lead to one or more light-emitting diodes and to a solid state active heat sink, and further comprising;
mounting a digital micro-mirror device controller to the substrate;
extending a controller lead from the substrate; and
after the over-molding step, electrically coupling the controller lead to a digital micro-mirror device.
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Accused Products
Abstract
LED lighting systems and methods of manufacture, which include one or more of the following: (1) a solid state active heat sink for cooling one or more LED chips; (2) a front end power supply providing high voltage to the active heat sink component; (3) a front end power supply that provides a relatively low voltage load to a plurality of LED chips; (4) a front end hybrid power supply with both a high and low voltage output, wherein the high voltage is at least 2kV higher than the low voltage output; (5) an over-mold encapsulating the front end components, wherein the over-mold is provided by a reaction injection molding process; (6) a digital micro-minor device (DMD) for providing pixilated light, color mixing, and intensity control; and (7) an optic having quantum dots (QDs), wherein the light output of the DMD activates for the QDs.
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Citations
11 Claims
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1. A method of manufacturing an LED lighting system, comprising:
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mounting a front end power supply on a substrate; extending electrical leads from the power supply; over-molding the front end power supply with a reactive injection molding process; and electrically coupling an extended electrical lead to one or more light-emitting diodes and to a solid state active heat sink, and further comprising;
mounting a digital micro-mirror device controller to the substrate;
extending a controller lead from the substrate; and
after the over-molding step, electrically coupling the controller lead to a digital micro-mirror device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification