Thin plate container and processing apparatus for thin plate container

• US 8,480,348 B2
• Filed: 09/20/2006
• Issued: 07/09/2013
• Est. Priority Date: 09/30/2005
• Status: Expired due to Fees

• Current Assignee: Miraial Company Limited
• Original Assignee: Miraial Company Limited
• Inventors: Hyobu, Yukihiro, Osada, Atsushi
• Primary Examiner(s): RUDAWITZ, JOSHUA I
• Application Number:
  US11/992,588
• Publication Number:
  US 20090297303A1
• Time in Patent Office: 2,484 Days
• Field of Search: 206/710, 206/509, 414/304, 414/941
• US Class Current: 414/304
• CPC Class Codes: H01L 21/67346 characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers

Abstract

Arbitrary pieces of semiconductor wafers are supported flexibly on either the upper side or the lower side. The present invention is a thin plate container for supporting plural semiconductor wafers for use in carriage, storage, processing, etc. It comprises processing trays plurally stacked in a state of each supporting at least one semiconductor wafer individually and a coupling mechanism for integrally coupling the processing trays in a state where the processing trays are plurally stacked and separating the processing trays at an arbitrary location. Each processing tray has a one-side support for supporting at least one semiconductor wafer on its one side and the other-side support mutually fitted to the one-side support of the other processing tray on the other side to form a housing space sealed off from the external environment for constraining and supporting the thin plate. Accordingly, as many processing trays as the number of the semiconductor wafers are stacked to constitute the thin plate container.

Claims

1. A processing apparatus for a thin plate container, the processing apparatus comprising:

a thin plate container for supporting one or plural thin plates for use in carriage, storage, and processing, the thin plate container comprising;

a plurality of processing trays arranged in a stack, each processing tray supporting at least one thin plate;

a coupling mechanism for integrally coupling together said plurality of processing trays in the stack and allowing said processing trays to be separated at any location within the stack,

wherein said each processing tray includes first side and second side supports for supporting opposing sides of at least one thin plate, said first and second side supports mutually fitting together to form a housing space sealed off from the external environment for constraining and supporting said thin plate sandwiched therebetween within the housing space;

a mounting table for mounting the thin plate container;

a separation mechanism for separating and opening the thin plate container mounted on said mounting table at any location within said stack; and

a loader/unloader for loading in and out a thin plate housed at the arbitrary location opened by said separation mechanism.

2. The thin plate container according to claim 1, wherein said first and second side supports respectively have a round protrusion and a round recess which mates with said round protrusion to define the housing space therebetween, whereby said first side functions as a lid side, and said second side support functions as a container side, to support said thin plate.

3. The thin plate container according to claim 1, wherein said coupling mechanism comprises a coupling portion provided an one of said support sides of each processing tray and a coupled portion provided on the other of said support sides of each processing tray and coupled with said coupling portion, and said coupling portion is coupled to said coupled portion of at least one adjacent processing tray to hold the entire stack as an integral unit, and wherein a coupled coupling portion and coupled portion may be separated at an arbitrary location to enable the stack to be separated into two at any location within the stack.

4. The thin plate container according to claim 1, wherein said coupling mechanism comprises a guide means for supporting and guiding said each processing tray and a clamp for integrally holding said entire stack of processing trays, each processing tray being supported and guided by said guide means and allowing said stack to be separated into two at any location within the stack.

5. The thin plate container according to claim 1, wherein the processing trays located at each of opposing ends of the stack has a kinematic groove for attachment to a processing apparatus, and

wherein said first side support supports said thin plate in a case where one end of said stack is uppermost and said second side support supports said thin plate in a case where the other end of said stack is uppermost.

6. The thin plate container according to claim 1, wherein a gasket for sealing off said housing space is provided between said first and second side portions of each processing tray.

7. The processing apparatus for a thin plate container according to claim 1, wherein said separation mechanism comprises a release key for separating processing trays of the thin plate container at any location within the stack and a lift for lifting each processing tray from the arbitrary location.

8. The thin plate container according to claim 1 wherein each processing tray contains a single thin plate.