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Ultra-flat, high throughput wafer lapping process

  • US 8,480,456 B1
  • Filed: 11/28/2012
  • Issued: 07/09/2013
  • Est. Priority Date: 06/19/2007
  • Status: Expired due to Fees
First Claim
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1. An apparatus for polishing wafers and other substantially thin, rigid materials, comprising:

  • a rotatable flat, lapping platen;

    a plurality of wafer carriers, each adapted to receive at least one wafer;

    a plurality of rotatable pressurized heads configured to rotate in counterbalanced pairs in both clockwise and counterclockwise directions and configured to apply pressure against the plurality of wafer carriers and the lapping platen; and

    a plurality of concentric conditioning rings configured around a respective one of the plurality of rotatable pressurized heads.

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