Plasma processing apparatus
First Claim
1. A plasma processing apparatus comprising:
- a processing chamber whose ceiling portion is opened and the inside thereof can be evacuated to vacuum;
a substrate holder, installed in the processing chamber, for mounting a substrate to be processed;
a ceiling plate which is made of a microwave transmissive dielectric material and is airtightly mounted to an opening of the ceiling portion;
a planar antenna member, which is installed on a top surface of the ceiling plate, for introducing a microwave into the processing chamber; and
a coaxial waveguide, which has a central conductor connected to a center portion of the planar antenna member, for supplying the microwave,wherein an electric field attenuating recess is formed on a top surface of a center area of the ceiling plate, anda gas passage is formed in the central conductor to pass through the planar antenna member,wherein a diameter of the electric field attenuating recess is determined to cancel horizontal microwaves transmitted into the electric field attenuating recess in a horizontal direction by canceling the horizontal microwaves having directions opposite to each other, anda depth of the electric field attenuating recess is determined to cancel vertical microwaves transmitted into the electric field attenuating recess in a vertical direction by canceling the vertical microwaves having directions opposite to each other, thereby attenuating an electric field intensity at a center portion of the ceiling plate until the electric field intensity at the center portion of the ceiling plate becomes substantially zero.
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Accused Products
Abstract
The present invention relates to a plasma processing apparatus including: a processing chamber whose ceiling portion is opened and the inside thereof can be evacuated to vacuum; a ceiling plate which is made of dielectric material and is airtightly mounted to an opening of the ceiling portion; a planar antenna member which is installed on a top surface of the ceiling plate, for introducing a microwave into the processing chamber; and a coaxial waveguide, which has a central conductor connected to the planar antenna member, for supplying the microwave, wherein a gas passage is formed to pass through the central conductor, the planar antenna member, and the ceiling plate, and an electric field attenuating recess for attenuating an electric field intensity of the center portion of the ceiling plate is installed on a top surface of a center area of the ceiling plate.
8 Citations
8 Claims
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1. A plasma processing apparatus comprising:
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a processing chamber whose ceiling portion is opened and the inside thereof can be evacuated to vacuum; a substrate holder, installed in the processing chamber, for mounting a substrate to be processed; a ceiling plate which is made of a microwave transmissive dielectric material and is airtightly mounted to an opening of the ceiling portion; a planar antenna member, which is installed on a top surface of the ceiling plate, for introducing a microwave into the processing chamber; and a coaxial waveguide, which has a central conductor connected to a center portion of the planar antenna member, for supplying the microwave, wherein an electric field attenuating recess is formed on a top surface of a center area of the ceiling plate, and a gas passage is formed in the central conductor to pass through the planar antenna member, wherein a diameter of the electric field attenuating recess is determined to cancel horizontal microwaves transmitted into the electric field attenuating recess in a horizontal direction by canceling the horizontal microwaves having directions opposite to each other, and a depth of the electric field attenuating recess is determined to cancel vertical microwaves transmitted into the electric field attenuating recess in a vertical direction by canceling the vertical microwaves having directions opposite to each other, thereby attenuating an electric field intensity at a center portion of the ceiling plate until the electric field intensity at the center portion of the ceiling plate becomes substantially zero. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A plasma processing apparatus comprising:
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a processing chamber whose ceiling portion is opened and the inside thereof can be evacuated to vacuum; a substrate holder, installed in the processing chamber, for mounting a substrate to be processed; a ceiling plate which is made of a microwave transmissive dielectric material and is airtightly mounted to an opening of the ceiling portion; a planar antenna member, which is installed on a top surface of the ceiling plate, for introducing a microwave into the processing chamber; and a coaxial waveguide, which has a central conductor connected to the planar antenna member, for supplying the microwave, wherein an electric field attenuating recess is formed on a top surface of the ceiling plate, and a gas passage is formed in the central conductor to pass through the planar antenna member, wherein a diameter of the electric field attenuating recess is determined to cancel horizontal microwaves transmitted into the electric field attenuating recess in a horizontal direction by canceling the horizontal microwaves having directions opposite to each other, and a depth of the electric field attenuating recess is determined to cancel vertical microwaves transmitted into the electric field attenuating recess in a vertical direction by canceling the vertical microwaves having directions opposite to each other, thereby attenuating an electric field intensity at a portion of the ceiling plate corresponding to the installation position of the electric field attenuating recess until the electric field intensity at the portion of the ceiling plate becomes substantially zero.
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Specification