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Method of attaching die to circuit board with an intermediate interposer

  • US 8,481,861 B2
  • Filed: 06/09/2011
  • Issued: 07/09/2013
  • Est. Priority Date: 06/27/2007
  • Status: Active Grant
First Claim
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1. A printed circuit board comprising:

  • a board having a substrate formed of a first material having a first coefficient of thermal expansion, and having circuit traces;

    a die secured to said board, said die having circuit traces electrically connected to said board circuit traces, and said die having a base formed of a second material having a second coefficient of thermal expansion different than said first coefficient of thermal expansion;

    an interposer material positioned between said die and said board, said interposer having an electrical connection connecting said die circuit traces to said board circuit traces, said interposer being formed of a third material having a coefficient of thermal expansion intermediate said first and second coefficients of thermal expansion;

    wherein said interposer includes a base material with a plurality of openings, said openings receiving a conductive material to connect said die to said board; and

    wherein said interposer is formed of a polyimide of bismuth telluride.

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