Semiconductor light-emitting device and manufacturing method

• US 8,482,016 B2
• Filed: 02/14/2012
• Issued: 07/09/2013
• Est. Priority Date: 02/14/2011
• Status: Active Grant

• Current Assignee: Stanley Electric Company Limited
• Original Assignee: Stanley Electric Company Limited
• Inventors: Harada, Mitsunori
• Primary Examiner(s): Le, Thao P.
• Application Number:
  US13/396,591
• Publication Number:
  US 20120211774A1
• Time in Patent Office: 511 Days
• Field of Search: 257/88, 257/98, 257/E33.072, 438/29
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located over at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The light-emitting device can include a base board, a frame located on the base board, the chip mounted on the base board, the wavelength converting layer located between an optical plate and the chip so as to extend from the optical plate toward the chip, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the optical plate.

Claims

1. A semiconductor light-emitting device comprising:

a base board having a mounting surface and a conductor pattern located adjacent the mounting surface;

a semiconductor light-emitting chip having a top surface, a side surface, a bottom surface and an edge located between the top surface and the side surface, located adjacent the mounting surface of the base board so that the bottom surface faces the mounting surface, and the semiconductor light-emitting chip includes a substrate having a top surface and at least one semiconductor layer having a top surface, a side surface, a bottom surface and a light-emitting layer located between the top surface and the bottom surface of the semiconductor layer, the top surface of the substrate including the edge of the semiconductor light-emitting chip, the at least one semiconductor layer located adjacent the top surface of the substrate so that the bottom surface of the semiconductor layer faces the top surface of the substrate, and including at least one chip electrode adjacent the top surface of the at least one semiconductor layer, the at least one chip electrode electrically connected to a portion of the conductor pattern of the base board via a bonding wire;

an optical plate having a side surface, a bottom surface and an edge located between the side surface and the bottom surface, the optical plate being located over the top surface of the at least one semiconductor layer of the semiconductor light-emitting chip so that the bottom surface of the optical plate overlaps the top surface of the at least one semiconductor layer;

a wavelength converting layer having a side surface and a thickness, the wavelength converting layer disposed between the edge of the optical plate and the edge of the semiconductor light-emitting chip so that the side surface of the wavelength converting layer extends from the edge of the optical plate toward the edge of the semiconductor light-emitting chip, and the wavelength converting layer encapsulating the at least one semiconductor layer and a part of the bonding wire;

a frame located adjacent the mounting surface of the base board so as to surround the semiconductor light-emitting chip and the wavelength converting layer; and

a reflective material layer having an inclined surface disposed between the frame and the side surface of the semiconductor light-emitting chip, the side surface of the wavelength converting layer and the side surface of the optical plate while also surrounding another part of the bonding wire, wherein the inclined surface contacts with the side surface of the wavelength converting layer and extends from the edge of the optical plate toward the edge of the wavelength converting layer.

2. The semiconductor light-emitting device according to claim 1, further comprising:

a reflective layer located between the light-emitting layer of the at least one semiconductor layer and the top surface of the substrate.

3. The semiconductor light-emitting device according to claim 1, wherein the inclined surface of the reflective material layer is formed in at least one of a substantially linear shape and a convex shape having a curvature of an inverse of the thickness of the wavelength converting layer or less extending in a direction toward the frame between the edge of the semiconductor light-emitting chip and the edge of the optical plate.

4. The semiconductor light-emitting device according to claim 2, wherein the inclined surface of the reflective material layer is formed in at least one of a substantially linear shape and a convex shape having a curvature of an inverse of the thickness of the wavelength converting layer or less extending in a direction toward the frame between the edge of the semiconductor light-emitting chip and the edge of the optical plate.

5. The semiconductor light-emitting device according to claim 1, wherein the inclined surface of the reflective material layer extends from the edge of the semiconductor light-emitting chip in line with the side surface of the semiconductor light-emitting chip so that at least the side surface of the semiconductor layer becomes substantially parallel with the inclined surface near the edge of the semiconductor light-emitting chip.

6. The semiconductor light-emitting device according to claim 2, wherein the inclined surface of the reflective material layer extends from the edge of the semiconductor light-emitting chip in line with the side surface of the semiconductor light-emitting chip so that at least the side surface of the semiconductor layer becomes substantially parallel with the inclined surface near the edge of the semiconductor light-emitting chip.

7. The semiconductor light-emitting device according to claim 1, further comprising:

a particulate spacer disposed in the wavelength converting layer, wherein the thickness of the wavelength converting layer is defined between the top surface of the at least one semiconductor layer of the semiconductor light-emitting chip and the bottom surface of the optical plate by supporting the bottom surface of the optical plate using the particulate spacer located on the top surface of the at least one semiconductor layer.

8. The semiconductor light-emitting device according to claim 2, further comprising:

a particulate spacer disposed in the wavelength converting layer, wherein the thickness of the wavelength converting layer is defined between the top surface of the at least one semiconductor layer of the semiconductor light-emitting chip and the bottom surface of the optical plate by supporting the bottom surface of the optical plate using the particulate spacer located on the top surface of the at least one semiconductor layer.

17. A method for manufacturing the semiconductor light-emitting device according to claim 1, comprising:

providing the base board;

connecting the at least one chip electrode of the at least one semiconductor layer of the semiconductor light-emitting chip to the portion of the conductor pattern of the base board via the bonding wire;

disposing an uncured wavelength converting material between the edge of the optical plate and the edge of the semiconductor light-emitting chip so that the side surface of the wavelength converting layer extends from the edge of the optical plate toward the edge of the semiconductor light-emitting chip; and

disposing an uncured reflective material between the frame and the side surface of the semiconductor light-emitting chip, the side surface of the wavelength converting layer and the side surface of the optical plate.

18. The method for manufacturing the semiconductor light-emitting device according to claim 17, wherein the inclined surface of the reflective material layer is formed in at least one of a substantially linear shape and a convex shape having a curvature of an inverse of the thickness of the wavelength converting layer or less extending in a direction toward the frame between the edge of the semiconductor light-emitting chip and the edge of the optical plate.

9. A semiconductor light-emitting device comprising:

a base board having a mounting surface and a conductor pattern located adjacent the mounting surface;

a plurality of semiconductor light-emitting chips having a top surface, a side surface, an edge located between the top surface and the side surface and at least one pair of adjacent surfaces each having an edge, and each of the semiconductor light-emitting chips including a substrate having a top surface and a semiconductor layer having a top surface, a side surface, a bottom surface and a light-emitting layer located between the top surface and the bottom surface of the semiconductor layer, being formed in a substantially cubic shape, the top surface of the substrate of each of the semiconductor light-emitting chips including the edge of the semiconductor light-emitting chips and edge of each of the at least one pair of adjacent surfaces, the top surface of the semiconductor layer of each of the semiconductor light-emitting chips including at least one chip electrode adjacent the top surface of the semiconductor layer of each of the semiconductor light-emitting chips, the at least one chip electrode of each of the semiconductor light-emitting chips electrically connected to a respective portion of the conductor pattern of the base board via a respective one of bonding wires, and the plurality of semiconductor light-emitting chips aligned adjacent the mounting surface of the base board so that each of the at least one pair of adjacent surfaces is substantially parallel with respect to each other;

an optical plate having a side surface, a bottom surface and an edge located between the side surface and the bottom surface of the optical plate, the optical plate being located over the top surface of the semiconductor layer of each of the semiconductor light-emitting chips so that the bottom surface of the optical plate overlaps the top surface of the semiconductor layer of each of the semiconductor light-emitting chips;

a wavelength converting layer having a side surface, a thickness and at least one concave surface, the wavelength converting layer disposed between the edge of the optical plate and the edge of the semiconductor light-emitting chips so that the side surface of the wavelength converting layer extends from the edge of the optical plate toward the edge of the semiconductor light-emitting chips, the at least one concave surface of the wavelength converting layer being formed in a concave shape from the edge of each of the at least one pair of adjacent surfaces of the semiconductor light-emitting chips toward the optical plate, and the wavelength converting layer encapsulating the semiconductor layer of each of the semiconductor light-emitting chips and a part of the respective one of the bonding wires;

a frame located adjacent the mounting surface of the base board so as to surround the semiconductor light-emitting chips and the wavelength converting layer; and

a reflective material layer having an inclined surface and at least one convex surface disposed between the frame and the side surface of the semiconductor light-emitting chips, the side surface of the wavelength converting layer and the side surface of the optical plate and between the at least one concave surface of the wavelength converting layer and the mounting surface of the base board while also surrounding another part of the respective one of the bonding wires, wherein the inclined surface contacts with the side surface of the wavelength converting layer and extends from the edge of the optical plate toward the edge of the wavelength converting layer, and the at least one convex surface also contacts with the at least one concave surface of the wavelength converting layer and extends between the at least one pair of adjacent surfaces of the plurality of semiconductor light-emitting chips and underneath the at least one concave surface of the wavelength converting layer.

10. The semiconductor light-emitting device according to claim 9, further comprising:

a reflective layer located between the light-emitting layer of the semiconductor layer of each of the semiconductor light-emitting chips and the top surface of the substrate of each of the semiconductor light-emitting chips.

11. The semiconductor light-emitting device according to claim 9, wherein the inclined surface of the reflective material layer is formed in at least one of a substantially linear shape and a convex shape having a curvature of an inverse of the thickness of the wavelength converting layer or less extending in a direction toward the frame between the edge of the semiconductor light-emitting chips and the edge of the optical plate.

12. The semiconductor light-emitting device according to claim 10, wherein the inclined surface of the reflective material layer is formed in at least one of a substantially linear shape and a convex shape having a curvature of an inverse of the thickness of the wavelength converting layer or less extending in a direction toward the frame between the edge of the semiconductor light-emitting chips and the edge of the optical plate.

13. The semiconductor light-emitting device according to claim 9, wherein the inclined surface of the reflective material layer extends from the edge of the semiconductor light-emitting chips in line with the side surface of the semiconductor light-emitting chips so that at least the side surface of the semiconductor layer of each of the semiconductor light-emitting chips becomes substantially parallel with the inclined surface near the edge of the semiconductor light-emitting chips that is located adjacent the side surface of the semiconductor layer of each of the semiconductor light-emitting chips.

14. The semiconductor light-emitting device according to claim 10, wherein the inclined surface of the reflective material layer extends from the edge of the semiconductor light-emitting chips in line with the side surface of the semiconductor light-emitting chips so that at least the side surface of the semiconductor layer of each of the semiconductor light-emitting chips becomes substantially parallel with the inclined surface near the edge of the semiconductor light-emitting chips that is located adjacent the side surface of the semiconductor layer of each of the semiconductor light-emitting chips.

15. The semiconductor light-emitting device according to claim 9, further comprising:

a particulate spacer disposed in the wavelength converting layer, wherein the thickness of the wavelength converting layer is defined between the top surface of the semiconductor layer of each of the semiconductor light-emitting chips and the bottom surface of the optical plate by supporting the bottom surface of the optical plate using the particulate spacer located on the top surface of the semiconductor layer of each of the semiconductor light-emitting chips.

16. The semiconductor light-emitting device according to claim 10, further comprising:

a particulate spacer disposed in the wavelength converting layer, wherein the thickness of the wavelength converting layer is defined between the top surface of the semiconductor layer of each of the semiconductor light-emitting chips and the bottom surface of the optical plate by supporting the bottom surface of the optical plate using the particulate spacer located on the top surface of the semiconductor layer of each of the semiconductor light-emitting chips.

19. A method for manufacturing the semiconductor light-emitting device according to 9, comprising:

providing the base board;

connecting the at least one chip electrode of each of the semiconductor light-emitting chips to the respective portion of the conductor pattern of the base board via the respective one of the bonding wires;

disposing an uncured wavelength converting material between the edge of the optical plate and the edge of the semiconductor light-emitting chips so that the side surface of the wavelength converting layer extends from the edge of the optical plate toward the edge of the semiconductor light-emitting chips; and

disposing an uncured reflective material between the frame and the side surface of the semiconductor light-emitting chips, the side surface of the wavelength converting layer and the side surface of the optical plate.

20. The method for manufacturing the semiconductor light-emitting device according to 19, wherein the inclined surface of the reflective material layer is formed in at least one of a substantially linear shape and a convex shape having a curvature of an inverse of the thickness of the wavelength converting layer or less extending in a direction toward the frame between the edge of the semiconductor light-emitting chips and the edge of the optical plate.