Methods of forming insulated wires and hermetically-sealed packages for use in electromagnetic devices

• US 8,484,831 B2
• Filed: 07/27/2010
• Issued: 07/16/2013
• Est. Priority Date: 07/27/2010
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Piascik, James, Oboodi, Reza, Franconi, Robert
• Primary Examiner(s): Kim, Paul D
• Application Number:
  US12/844,611
• Publication Number:
  US 20120023870A1
• Time in Patent Office: 1,085 Days
• Field of Search: 296/021, 296/05, 296/06, 296/08, 264/250, 264/272.19, 336/83, 336/175, 336/192, 336/200, 336/212, 336/233
• US Class Current: 29/606
• CPC Class Codes: H01B 3/084 Glass or glass wool in binder
• CPC Class Codes: H01B 3/12 ceramics
• CPC Class Codes: H01F 41/005 Impregnating or encapsulating insulating of windings H01F41/12
• CPC Class Codes: H01F 5/02 wound on non-magnetic supports, e.g. formers
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49076 From comminuted material

Abstract

A method includes coating a conductive wire with a paste comprising a first inorganic dielectric material, an organic binder, and a solvent to form a coated wire, drying the coated wire at a first drying temperature to remove at least a portion of the solvent and form a green wire, winding the green wire around a core to form a green assembly, heat treating the green assembly at a decomposing temperature above the first temperature and below a melting point of the first inorganic dielectric material to decompose the organic binder to form an intermediate assembly, and exposing the intermediate assembly to a densifying temperature that is above the decomposing temperature and substantially equal to or above the melting point of the first inorganic dielectric material to densify the dielectric material on the conductive wire.

Claims

1. A method of forming an insulated wire, comprising:

coating a conductive wire with a paste comprising a first inorganic dielectric material, an organic binder, and a solvent to form a coated wire;

drying the coated wire at a first drying temperature to remove at least a portion of the solvent and form a green wire;

winding the green wire around a core to form a green assembly; and

heat treating the green assembly at a first decomposing temperature above the first temperature and below a first melting point of the first inorganic dielectric material to decompose the organic binder to form an intermediate assembly.

2. The method of claim 1, wherein the step of coating comprises impregnating a porous pad with the paste and drawing the conductive wire through the impregnated porous pad to form the coated wire.

3. The method of claim 2, further comprising repeating the step of drawing the conductive wire through the impregnated porous pad to form a plurality of layers of the paste.

4. The method of claim 1, wherein the conductive wire comprises a material selected from a group consisting of nickel, copper, silver, and silver/palladium.

5. The method of claim 1, wherein the inorganic dielectric material comprises a material selected from a group consisting of a glass dielectric, a ceramic dielectric, and a combination thereof.

6. The method of claim 1, wherein the organic binder comprises a binder selected from a group consisting of acrylic, polyvinyl alcohol, and polyethylene oxide.

7. The method of claim 1, wherein the first decomposing temperature is in a range of about 350°

C. to about 450°

C.

8. The method of claim 1, wherein the conductive wire comprises copper and the step of heat treating the green assembly comprises performing the heat treating in the presence of oxygen.

9. The method of claim 1, further comprising heating the intermediate assembly to a predetermined elevated temperature exceeding the first decomposing temperature and substantially equal to or exceeding the softening point of the first inorganic dielectric material.

10. The method of claim 9, wherein the predetermined elevated temperature is a densifying temperature substantially equal to or exceeding the melting point of the first inorganic dielectric material, and wherein the step of heating comprises heating the intermediate assembly to the densifying temperature to melt the first inorganic dielectric material on the conductive wire.

11. The method of claim 10, wherein the densifying temperature is in a range of about 800°

C. to about 850°

C.

12. The method of claim 9, wherein the predetermined elevated temperature is a sintering temperature less than the melting point of the first inorganic dielectric material, and wherein the step of heating comprises heating the intermediate assembly to the sintering temperature to sinter the first inorganic dielectric material on the conductive wire.

13. A method of forming a hermetically-sealed package for an electromagnetic device, the method comprising:

coating a copper wire with a paste to form a coated wire, the paste comprising a first inorganic dielectric material, an organic binder, and a solvent;

drying the coated wire at a first drying temperature to remove at least a portion of the solvent and form a green wire;

winding the green wire around a core to form a green assembly;

subjecting the green assembly to a sintering temperature that is substantially equal to a softening point temperature of the first inorganic dielectric material to decompose the organic binder and form an intermediate assembly;

vacuum impregnating an outer layer material into the intermediate assembly, the outer layer material comprising a second dielectric material selected from a group consisting of the first dielectric material and overglaze material having a formulation that is different than the first dielectric material, the second dielectric material having a melting point and including an organic material;

drying the impregnated intermediate assembly at a second drying temperature in a vacuum or inert atmosphere to remove at least a portion of the solvent;

heating the dried impregnated intermediate assembly at a decomposing temperature that is above the second drying temperature and below the second melting point of the second dielectric material to decompose the organic material of the second dielectric material;

exposing the impregnated intermediate assembly to a densifying temperature in a vacuum or inert atmosphere, wherein the densifying temperature is equal to or above the melting point of the first and the second inorganic dielectric material to melt the first and the second dielectric material on the conductive wire; and

sealing the assembly within a cylinder in a vacuum or inert atmosphere to form the hermetically-sealed package.

14. The method of claim 13, further comprising the step of pre-coating the core with the first dielectric material.

15. The method of claim 13, wherein the core includes an end wall including a feed-through hole, and the method further comprises inserting an end of the green wire through the feed-through hole before the step of heat treating.

16. The method of claim 15, wherein the step of sealing comprises welding the cylinder to the end wall.

17. The method of claim 15, further comprising filling the feed-through hole with a glass material after the step of exposing the impregnated green assembly and before the step of sealing.

18. The method of claim 13, wherein the inorganic dielectric material comprises a material selected from a group consisting of a glass dielectric, a ceramic dielectric, and a combination thereof.

19. The method of claim 13, wherein the organic binder comprises a binder selected from a group consisting of acrylic, polyvinyl alcohol, and polyethylene oxide.

20. The method of claim 13, wherein:

the conductive wire comprises copper and the step of heat treating the green assembly comprises performing the heat treating in the presence of oxygen.