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Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

  • US 8,485,418 B2
  • Filed: 11/09/2010
  • Issued: 07/16/2013
  • Est. Priority Date: 05/26/1995
  • Status: Expired due to Fees
First Claim
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1. A method of forming a contact assembly comprising:

  • fabricating a plurality of contact structures each comprising an elongate body that is flexible and resilient;

    providing a first substrate comprising an array of electrical connections on a surface of said first substrate; and

    after said fabricating step and said providing step, attaching ones of said plurality of contact structures to ones of said electrical connections such that said elongate bodies of said ones of said contact structures extend away from said surface of said first substrate and stand on said first substrate free of material between said elongate bodies that mechanically couples any one of said elongate bodies to any other of said elongate bodies,wherein said fabricating comprises;

    forming said contact structures on a second substrate, andremoving said contact structures from said second substrate.

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