High powered light emitting diode lighting unit

• US 8,485,691 B2
• Filed: 01/06/2012
• Issued: 07/16/2013
• Est. Priority Date: 05/13/2011
• Status: Active Grant

• Current Assignee: Lumenpulse Group Inc.
• Original Assignee: Lumenpulse Lighting Inc (Lumenpulse Inc.)
• Inventors: Hamel, Yvan, Campbell, Gregory
• Primary Examiner(s): Green, Tracie Y
• Application Number:
  US13/345,030
• Publication Number:
  US 20120287613A1
• Time in Patent Office: 557 Days
• Field of Search: 313501-512, 362/555, 362/294, 362/345, 362/373
• US Class Current: 362/294
• CPC Class Codes: F21V 21/30 Pivoted housings or frames
• CPC Class Codes: F21V 23/023 Power supplies in a casing F21V23/003 takes precedence
• CPC Class Codes: F21V 29/15 Thermal insulation
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 5/007 Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane combination of two or more refractors F21V5/008
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A light emitting diode (LED) lighting unit including power supply housing accommodating a power supply and an LED array housing defining an internal compartment and a lens sealing the internal compartment. An LED array and an LED control circuit are mounted on a printed circuit board, which is accommodated within the compartment. The rear surface of the LED array housing includes a heat transfer element. At least one of the LED array and power supply housings has a chimney extending therethrough from a front to rear surface. The rear surface of the LED array housing is spaced from the front surface of the power supply housing to define and airflow space therebetween. During operation of the LED lighting unit, air flows into the airflow space and toward a central axis of the LED lighting unit before flowing out through the chimney to facilitate removing heat from the LED lighting unit.

Claims

1. A solid-state lighting unit comprising:

a solid-state array housing defining an internal compartment;

at least one solid-state array module, comprising;

an array of solid-state lighting elements;

a solid-state lighting element control circuit; and

a printed circuit board, the solid-state array module being accommodated within the internal compartment of the solid-state array housing;

a rear surface of the solid-state array housing comprising a heat transfer element; and

a power supply housing accommodating a power supply, the power supply housing having a front surface opposing the rear surface of the solid-state array housing, and having a chimney extending therethrough from the front surface of the power supply housing to a rear surface thereof;

the rear surface of the solid-state array housing being fixedly disposed in a spaced apart relationship with respect to the front surface of the power supply housing, such that an input airflow space is defined therebetween so that, during operation of the solid-state lighting unit, outside air flows, in a first direction, into the input airflow space and toward the center of the solid-state lighting unit and exits, in a second direction, through the chimney to facilitate removal of heat from the solid-state lighting elements, wherein the first direction is substantially perpendicular to the second direction.

2. The lighting unit of claim 1, wherein the array of solid-state lighting elements and solid-state lighting element control circuit are mounted on a first surface of the printed circuit board.

3. The lighting unit of claim 1, wherein the array of solid-state lighting elements comprises a tightly spaced array of light emitting diodes (LED).

4. The lighting unit of claim 1, further comprising at least one transparent lens for sealing the internal compartment.

5. The lighting unit of claim 1, wherein solid-state array housing and the power supply housing are substantially aligned with respect to each other along a central illumination axis, also having substantially uniform spacing therebetween.

6. The lighting unit of claim 1, wherein the heat transfer element comprises a plurality of protruding features extending away from the rear surface of the solid-state array housing and towards the front surface of the power supply housing, remaining physically separated from the power supply housing.

7. The lighting unit of claim 6, wherein the plurality of protruding features comprise a plurality of protruding ridges defining airflow channels therebetween, the plurality of ridges separated from the power supply housing by a thermal isolation gap.

8. The lighting unit of claim 7, wherein the ridges are substantially linear, extending across the rear surface of the solid-state array housing, exposed ends of the ridges defining convective inlet passages.

9. The lighting unit of claim 1, wherein the chimney comprises a lumen aligned along a central illumination axis.

10. The lighting unit of claim 9, wherein the chimney comprises a first conically shaped lumen with its base facing the rear surface of the solid-state array housing, and a second conically shaped lumen with its base facing the rear surface of the power supply housing, the first and second conically shaped lumens joined together along a generally narrower throat section.

11. The lighting unit of claim 1, further comprising a plurality of support posts fixedly attached between the rear surface of the solid-state array housing and the front surface of the power supply housing, the support posts.

12. The lighting unit of claim 1, each support post of the plurality of support posts comprises a thermally isolating feature to inhibit conduction of thermal energy between the solid-state array housing and the power supply housing.