Telemetric orthopaedic implant
First Claim
1. A telemetric orthopaedic implant system, the system comprising:
- a. an orthopaedic implant, the orthopaedic implant comprising;
i. at least one sensor;
ii. a first recess adapted to receive said at least one sensor;
iii. an electronic component electrically connected to said at least one sensor, the electronic component including at least a power supply, a first transmitter, a first receiver, and a first microprocessor;
iv. a second recess adapted to receive the electronic component;
v. potting material to seal said first recess and said second recess;
vi. a power source electrically connected to said electronic component; and
vii. an acting unit electrically connected to said electronic component, said acting unit adapted to carry out a function based upon a condition; and
b. a control unit, the control unit comprising;
i. a second microprocessor;
ii. a second transmitter electrically connected to said second microprocessor, the second transmitter adapted to send a signal to said first receiver of said electronic component; and
iii. a second receiver electrically connected to said second microprocessor, the second receiver adapted to receive data from said first transmitter of said electronic component.
2 Assignments
0 Petitions
Accused Products
Abstract
An instrumented orthopaedic implant, such as an intramedullary (IM) nail, is disclosed. The implant has the capacity to provide an accurate measurement of the applied mechanical load across the implant. The implant includes sensors and associated electronic components located in recesses on the outer surface of the implant. The implant houses the sensing apparatus, the interface circuitry, the data transmitter, and the power receiver. The hermetically sealed housing is adapted for implantation in the body of a patient. The implant is used with a controller which communicates with it by telemetry, and there is an acting unit connected to the electronic components which is adapted to carry out a function based upon a condition detected by the sensors.
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Citations
20 Claims
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1. A telemetric orthopaedic implant system, the system comprising:
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a. an orthopaedic implant, the orthopaedic implant comprising; i. at least one sensor; ii. a first recess adapted to receive said at least one sensor; iii. an electronic component electrically connected to said at least one sensor, the electronic component including at least a power supply, a first transmitter, a first receiver, and a first microprocessor; iv. a second recess adapted to receive the electronic component; v. potting material to seal said first recess and said second recess; vi. a power source electrically connected to said electronic component; and vii. an acting unit electrically connected to said electronic component, said acting unit adapted to carry out a function based upon a condition; and b. a control unit, the control unit comprising; i. a second microprocessor; ii. a second transmitter electrically connected to said second microprocessor, the second transmitter adapted to send a signal to said first receiver of said electronic component; and iii. a second receiver electrically connected to said second microprocessor, the second receiver adapted to receive data from said first transmitter of said electronic component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification