×

Telemetric orthopaedic implant

  • US 8,486,070 B2
  • Filed: 08/23/2006
  • Issued: 07/16/2013
  • Est. Priority Date: 08/23/2005
  • Status: Active Grant
First Claim
Patent Images

1. A telemetric orthopaedic implant system, the system comprising:

  • a. an orthopaedic implant, the orthopaedic implant comprising;

    i. at least one sensor;

    ii. a first recess adapted to receive said at least one sensor;

    iii. an electronic component electrically connected to said at least one sensor, the electronic component including at least a power supply, a first transmitter, a first receiver, and a first microprocessor;

    iv. a second recess adapted to receive the electronic component;

    v. potting material to seal said first recess and said second recess;

    vi. a power source electrically connected to said electronic component; and

    vii. an acting unit electrically connected to said electronic component, said acting unit adapted to carry out a function based upon a condition; and

    b. a control unit, the control unit comprising;

    i. a second microprocessor;

    ii. a second transmitter electrically connected to said second microprocessor, the second transmitter adapted to send a signal to said first receiver of said electronic component; and

    iii. a second receiver electrically connected to said second microprocessor, the second receiver adapted to receive data from said first transmitter of said electronic component.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×