Three axis magnetic sensor device and method
First Claim
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1. A method for fabricating a device for sensor magnetic fields, the method comprising:
- providing a substrate member having a surface region;
removing at least one portion of the substrate member;
forming an integrated circuit (IC) layer overlying the substrate member;
forming a first magnetic field sensor element comprising at least a first material and configured to detect at least an x-axis direction, the first magnetic field sensor element being operably coupled to the IC layer;
forming a second magnetic field sensor element comprising at least the first material and configured to detect at least a y-axis direction, the second magnetic field sensor element being operably coupled to the IC layer;
forming a third magnetic field sensor element comprising at least the first material and configured to detect at least a z-axis direction, the third magnetic field sensor element being operably coupled to the IC layer;
forming at least one magnetic field concentrator spatially disposed overlying at least one portion of the substrate member, the magnetic field concentrator being formed within a vicinity of the third magnetic field sensor element; and
forming at least one passivation material overlying the first, second, and third magnetic field sensor elements and the surface region;
wherein all of the x-axis, y-axis, and z-axis directions are configured in a mutually orthogonal manner.
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Abstract
A method and structure for a three-axis magnetic field sensing device is provided. The device includes a substrate, an IC layer, and preferably three magnetic field sensors coupled to the IC layer. A nickel-iron magnetic field concentrator is also provided.
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Citations
22 Claims
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1. A method for fabricating a device for sensor magnetic fields, the method comprising:
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providing a substrate member having a surface region; removing at least one portion of the substrate member; forming an integrated circuit (IC) layer overlying the substrate member; forming a first magnetic field sensor element comprising at least a first material and configured to detect at least an x-axis direction, the first magnetic field sensor element being operably coupled to the IC layer; forming a second magnetic field sensor element comprising at least the first material and configured to detect at least a y-axis direction, the second magnetic field sensor element being operably coupled to the IC layer; forming a third magnetic field sensor element comprising at least the first material and configured to detect at least a z-axis direction, the third magnetic field sensor element being operably coupled to the IC layer; forming at least one magnetic field concentrator spatially disposed overlying at least one portion of the substrate member, the magnetic field concentrator being formed within a vicinity of the third magnetic field sensor element; and forming at least one passivation material overlying the first, second, and third magnetic field sensor elements and the surface region; wherein all of the x-axis, y-axis, and z-axis directions are configured in a mutually orthogonal manner. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification