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Three axis magnetic sensor device and method

  • US 8,486,723 B1
  • Filed: 08/19/2010
  • Issued: 07/16/2013
  • Est. Priority Date: 08/19/2010
  • Status: Active Grant
First Claim
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1. A method for fabricating a device for sensor magnetic fields, the method comprising:

  • providing a substrate member having a surface region;

    removing at least one portion of the substrate member;

    forming an integrated circuit (IC) layer overlying the substrate member;

    forming a first magnetic field sensor element comprising at least a first material and configured to detect at least an x-axis direction, the first magnetic field sensor element being operably coupled to the IC layer;

    forming a second magnetic field sensor element comprising at least the first material and configured to detect at least a y-axis direction, the second magnetic field sensor element being operably coupled to the IC layer;

    forming a third magnetic field sensor element comprising at least the first material and configured to detect at least a z-axis direction, the third magnetic field sensor element being operably coupled to the IC layer;

    forming at least one magnetic field concentrator spatially disposed overlying at least one portion of the substrate member, the magnetic field concentrator being formed within a vicinity of the third magnetic field sensor element; and

    forming at least one passivation material overlying the first, second, and third magnetic field sensor elements and the surface region;

    wherein all of the x-axis, y-axis, and z-axis directions are configured in a mutually orthogonal manner.

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