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Structure and process for electrical interconnect and thermal management

  • US 8,486,765 B2
  • Filed: 09/21/2011
  • Issued: 07/16/2013
  • Est. Priority Date: 08/28/2007
  • Status: Active Grant
First Claim
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1. A method for making a structure for thermal management of circuit devices, comprising:

  • providing a first substrate and a second substrate, wherein at least one of the first and second substrates includes a circuit element;

    forming in at least one of the first substrate and the second substrate an entrance through-hole extending through a thickness of the first substrate or the second substrate;

    forming in at least one of the first substrate and the second substrate an exit through-hole extending through a thickness of the first substrate or the second substrate;

    forming respective bonding elements on at least one of the first and second substrates; and

    bonding the first and second substrates at the respective bonding elements to form a seal between the first and second substrates and to form a first coolant channel extending laterally between the first and second substrates and separating the first and second substrates principally by a thickness of the bonding elements.

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