AC light emitting assembly and AC light emitting device

• US 8,487,321 B2
• Filed: 12/12/2006
• Issued: 07/16/2013
• Est. Priority Date: 12/13/2005
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Yen, Hsi-Hsuan, Chi, Jim-Yong, Yeh, Wen-Yung, Lee, Ting-Chi, Lin, Ming-Te, Huang, Sheng-Pan
• Primary Examiner(s): WILCZEWSKI, MARY A
• Application Number:
  US11/609,538
• Publication Number:
  US 20070131942A1
• Time in Patent Office: 2,408 Days
• Field of Search: 257/88, 257/E33.012, 257/E33.051, 345/82, 340/815.45, 362/240, 362/249.02, 362/800
• US Class Current: 257/88
• CPC Class Codes: H05B 45/40 Details of LED load circuits
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

An alternating current (AC) light emitting assembly and an AC light emitting device are disclosed. The AC light emitting assembly includes a substrate; a rectifier unit comprising a plurality of rectifier components arranged in a Wheatstone Bridge, for rectifying an AC signal into a direct current (DC) signal, each of the rectifier components having a high breakdown voltage and a low forward voltage; a light emitting unit electrically connected to the rectifier unit and comprising a plurality of light emitting components formed on the substrate, for emitting light when receiving the DC signal outputted by the rectifier unit; and two conductive electrodes electrically connected to the rectifier unit for receiving and transmitting the AC signal to the rectifier unit. The AC light emitting device includes two stacked and electrically connected AC light emitting assemblies.

Claims

1. A light emitting device having two stacked and electrically connected alternating current (AC) light emitting assemblies, each assembly comprising:

an insulating substrate for a chip;

a rectifier unit comprising a plurality of rectifier components arranged in a Wheatstone Bridge, for rectifying an AC signal from a power source into a rectified AC signal, each of the rectifier components having a high breakdown voltage and a low forward voltage, wherein at least one of the rectifier components is a Schottky Barrier Diode (SBD);

a light emitting unit comprising a plurality of electrically connected light emitting components formed on the substrate, electrically connected to the rectifier unit, for emitting light when receiving the rectified AC signal directly from the rectifier unit; and

two conductive electrodes electrically connected to the rectifier unit for receiving and transmitting the AC signal to the rectifier unit.

2. The light emitting device of claim 1, wherein the SBD is a vertical-structured SBD.

3. The light emitting device of claim 1, wherein the SBD is a planer-structured SBD.

4. The light emitting device of claim 1, wherein the light emitting components are electrically connected to the rectifier components in series and parallel.

5. The light emitting device of claim 1, wherein the light emitting components emit light having the same wavelength.

6. The light emitting device of claim 1, wherein the light emitting components emit light having two different wavelengths.

7. The light emitting device of claim 1, 4, 5 or 6, wherein at least one of the light emitting components has a light emitting active layer.

8. The light emitting device of claim 7, wherein the light emitting active layer comprises a P-type semiconductor structure and an N-type semiconductor structure.

9. The light emitting device of claim 8, wherein each of the P- and N-type semiconductor structures has an ohmic electrode for electrical connection.

10. The light emitting device of claim 9, wherein the P-type semiconductor structure comprises P-InGaN.

11. The light emitting device of claim 9, wherein the N-type semiconductor structure comprises N-InGaN.

12. The light emitting device of claim 1, wherein at least one of the light emitting components has two light emitting active layers.

13. The light emitting device of claim 12, wherein the light emitting active layers are formed by an Epitaxy technique.

14. The light emitting device of claim 12, wherein the light emitting active layers are formed by a wafer bonding technique.

15. The light emitting device of claim 12, wherein the light emitting active layers are formed by a Flip Chip technique.

16. The light emitting device of claim 12, wherein at least one of the light emitting active layers comprises a P-type semiconductor structure and an N-type semiconductor structure.

17. The light emitting device of claim 16, wherein each of the P- and N-type semiconductor structures has an ohmic electrode for electrical connection.

18. The light emitting device of claim 17, wherein the P-type semiconductor structure comprises P-InGaN.

19. The light emitting device of claim 17, wherein the N-type semiconductor structure comprises N-InGaN.

20. The light emitting device of claim 1, wherein the substrate is a common substrate.