Assembly for liquid cooling electronics by direct submersion into circulated engine coolant

• US 8,488,321 B2
• Filed: 10/10/2011
• Issued: 07/16/2013
• Est. Priority Date: 10/10/2011
• Status: Active Grant

• Current Assignee: Delphi Technologies Ip Limited (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Brandenburg, Scott D., Parker, Richard D., Lashbrook, Joseph M.
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US13/269,656
• Publication Number:
  US 20130087307A1
• Time in Patent Office: 645 Days
• Field of Search: 361/699
• US Class Current: 361/699
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20872 Liquid coolant without phase change
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

An assembly for liquid cooling electronics by direct submersion into circulated engine coolant that includes an epoxy material dispensed around leads of electronics devices in a manner effective to mechanically secure the electronics devices to the assembly and prevent engine coolant leakage around the leads, and a Parylene™ coating layer deposited in a manner effective to protect the electronic device from electrically conductive engine coolant such as ethylene glycol. Such an assembly is useful in hybrid electric vehicles that have engine coolant available from the vehicle'"'"'s internal combustion engine.

Claims

1. An assembly for liquid cooling electronics by direct submersion into circulated engine coolant, said assembly comprising:

a housing configured to define a coolant inlet, a coolant outlet, and an opening providing access to engine coolant between the coolant inlet and the coolant outlet;

a plate configured to cooperate with the housing to form a fluidic seal along a perimeter of the opening, said plate also configured to define a via through the plate;

a circuit board fixedly attached to the plate outside the housing, said circuit board configured to provide an electrical contact proximate to the via;

an electronic device having a substantially planar shape that defines a plane, said electronic device located proximate to the plate inside the housing and oriented to protrude into the coolant path such that the plane is substantially parallel to a flow direction of the engine coolant;

a first heat spreader fixedly attached to a first planar side of the electronic device, said first heat spreader configured to define a first lead to electrically coupled the electronic device to the circuit board through the via;

a second heat spreader fixedly attached to a second planar side of the electronic device opposite the first planar side, said second heat spreader configured to define a second lead to electrically coupled the electronic device to the circuit board through the via, wherein the electronic device, the first heat spreader, and the second heat spreader form an arrangement;

an epoxy material region dispensed around the leads in a manner effective to mechanically secure the arrangement to the plate and prevent engine coolant leakage around the leads; and

a coating layer deposited in a manner effective to protect the electronic device from the engine coolant.

2. The assembly in accordance with claim 1, wherein the engine coolant is essentially ethylene glycol.

3. The assembly in accordance with claim 1, wherein the housing and the plate are formed of metal.

4. The assembly in accordance with claim 3, wherein the housing and the plate are formed of aluminum.

5. The assembly in accordance with claim 4, wherein the fluidic seal between the housing and the plate is formed by friction stir welding.

6. The assembly in accordance with claim 1, wherein the housing and the plate are formed of polymeric material.

7. The assembly in accordance with claim 6, wherein the fluidic seal between the housing and the plate is formed of adhesive.

8. The assembly in accordance with claim 1, wherein the electronic device includes an insulated gate bipolar transistor (IGBT) and a diode.

9. The assembly in accordance with claim 1, wherein the first heat spreader and the second heat spreader are predominately formed of a copper.

10. The assembly in accordance with claim 9, wherein the first heat spreader and the second heat spreader predominately formed of a molybdenum.

11. The assembly in accordance with claim 1, wherein the first heat spreader and the second heat spreader are fixedly attached to the electronic device by sintering.

12. The assembly in accordance with claim 1, wherein the first heat spreader and the second heat spreader are fixedly attached to the electronic device by soldering.

13. The assembly in accordance with claim 1, wherein the first heat spreader is fixedly attached to the electronic device by sintering, and the second heat spreader is fixedly attached to the electronic device by soldering.

14. An assembly for liquid cooling electronics by direct submersion into circulated engine coolant, said assembly comprising:

a housing formed of aluminum and configured to define a coolant inlet, a coolant outlet, and an opening providing access to engine coolant between the coolant inlet and the coolant outlet;

a plate formed of aluminum and configured to cooperate with the housing to form a fluidic seal along a perimeter of the opening, wherein the fluidic seal between the housing and the plate is formed by friction stir welding, said plate also configured to define a via through the plate;

a circuit board fixedly attached to the plate outside the housing, said circuit board configured to provide an electrical contact proximate to the via;

an electronic device having a substantially planar shape that defines a plane, said electronic device located proximate to the plate inside the housing and oriented to protrude into the coolant path such that the plane is substantially parallel to a flow direction of the engine coolant;

a first heat spreader predominately formed of a molybdenum and fixedly attached to a first planar side of the electronic device by soldering, said first heat spreader configured to define a first lead to electrically coupled the electronic device to the circuit board through the via;

a second heat spreader predominately formed of a molybdenum and fixedly attached to a second planar side of the electronic device opposite the first planar side by soldering, said second heat spreader configured to define a second lead to electrically coupled the electronic device to the circuit board through the via, wherein the electronic device, the first heat spreader and the second heat spreader form an arrangement;

an epoxy material region dispensed around the leads in a manner effective to mechanically secure the arrangement to the plate and prevent engine coolant leakage around the leads; and

a coating layer deposited in a manner effective to protect the electronic device from the engine coolant.